Inventor
Suguru Sakugawa
Inventor
Tokyo, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H01LSemiconductor devices20%
F17DPipe-line systems7%
G01MTesting static or dynamic balance of machines or structures7%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
10,792,784Leak checking method, and computer-readable storage medium for performing the leak checking method202010,556,314Head height adjustment device and substrate processing apparatus provided with head height adjustment device20209,922,852'Pressure calibration jig and substrate processing apparatus'20189,662,761'Polishing apparatus'20179,370,852'Pressure regulator and polishing apparatus having the pressure regulator'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2020Patents assigned to EBARA CORP (5)· patent assignee history
2016–2020Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 5 | 2016–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 5 | 2016–2020 |