Inventor
CHIH-CHENG HSIEH
Inventor
TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Nprimary
H04NPictorial communication, e.g. television25%
H01LSemiconductor devices19%
H05KPrinted circuits19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
G06TImage data processing or generation, in general6%
G06VImage or video recognition or understanding6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation6%
PatentTitleYear
12,532,409Circuit board202612,430,869Image sensor and method of operating the same202512,400,930Power module package202512,048,122Power module and power device202411,785,353Image sensor chip and sensing method thereof202311,770,642Image sensor integrated with convolutional neural network computation circuit202311,683,605Image sensor chip and sensing method thereof202311,387,180Power module including a carrier assembly with combination of circuit board and lead frame2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to NIKO SEMICONDUCTOR CO LTD (4)· patent assignee history
2022–2026Based in TW· patent location history
2023–2025Patents assigned to UNIV NAT TSING HUA (3)· patent assignee history
2023Patents assigned to EGIS TECH INC (1)· patent assignee history
2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NIKO SEMICONDUCTOR CO LTD | 4 | 2022–2026 |
| UNIV NAT TSING HUA | 3 | 2023–2025 |
| EGIS TECH INC | 1 | 2023 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 8 | 2022–2026 |