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Inventor

Kenichirou Ishimoto

Inventor
Yamanashi, JP

Overview

3→
Patents
2014–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits25%
Y10TTechnical subjects covered by former us classification25%
B29CShaping or joining of plastics13%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts13%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
PatentTitleYear
10,899,088Support and method of shaping workpiece and support20218,849,442'Component mounting line and component mounting method'20148,646,174'Device and method for mounting electronic components'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014Patents assigned to ISHIMOTO KENICHIROU (2)· patent assignee history
2014Patents assigned to PANASONIC CORP (2)· patent assignee history
2014Patents assigned to HIGASHI NOBORU (1)· patent assignee history
2014Patents assigned to KAIDA KENICHI (1)· patent assignee history
2014Patents assigned to KIHARA MASAHIRO (1)· patent assignee history
2014Based in Yamanashi, JP· patent location history
2021Based in Fukui, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ISHIMOTO KENICHIROUself22014
PANASONIC CORP22014
HIGASHI NOBORU12014
KAIDA KENICHI12014
KIHARA MASAHIRO12014
Locations
LocationPatentsSpan
Yamanashi, JP22014
Fukui, JP12021