Inventor
Eric D. Hobbs
Inventor
Livermore, CA, US
Overview
Patents· 41 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
B01LChemical or physical laboratory apparatus for general use10%
Y10TTechnical subjects covered by former us classification7%
G01NInvestigating or analysing materials by determining their chemical or physical properties6%
B03CMagnetic or electrostatic separation of solid materials from solid materials or fluids4%
B81BMicrostructural devices or systems, e.g. micromechanical devices3%
H01LSemiconductor devices3%
H10DInorganic electric semiconductor devices3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
PatentTitleYear
10,973,227Freezing and archiving cells on a microfluidic device202110,829,728Microfluidic devices for optically-driven convection and displacement, kits and methods thereof202010,821,439Movement and selection of micro-objects in a microfluidic apparatus202010,792,658Lateral/vertical transistor structures and process of making and using same202010,675,625Light sequencing and patterns for dielectrophoretic transport202010,646,871Microfluidic devices having isolation pens and methods of testing biological micro-objects with same202010,350,594Lateral/vertical transistor structures and process of making and using same201910,010,882Microfluidic devices having isolation pens and methods of testing biological micro-objects with same20189,908,115'Lateral/vertical transistor structures and process of making and using same'20189,744,533'Movement and selection of micro-objects in a microfluidic apparatus'20179,702,904'Non-linear vertical leaf spring'20178,872,532'Wafer test cassette system'20148,760,187'Thermocentric alignment of elements on parts of an apparatus'20148,736,294'Probe card stiffener with decoupling'20148,587,331'Test systems and methods for testing electronic devices'20138,400,173'Method and apparatus for thermally conditioning probe cards'20138,269,514'Method and apparatus for multilayer support substrate'20128,138,859'Switch for use in microelectromechanical systems (MEMS) and MEMS devices incorporating same'20128,120,373'Stiffener assembly for use with testing devices'20127,999,375'Electronic device with integrated micromechanical contacts and cooling system'20117,977,956'Method and apparatus for probe card alignment in a test system'20117,960,989'Mechanical decoupling of a probe card assembly to improve thermal response'20117,956,635'Stiffener assembly for use with testing devices'20117,884,627'Stiffener assembly for use with testing devices'20117,851,794'Rotating contact element and methods of fabrication'20107,845,072'Method and apparatus for adjusting a multi-substrate probe structure'20107,843,202'Apparatus for testing devices'20107,808,259'Component assembly and alignment'20107,772,863'Mechanical decoupling of a probe card assembly to improve thermal response'20107,746,089'Method and apparatus for indirect planarization'20107,732,975'Biased gap-closing actuator'20107,692,433'Sawing tile corners on probe card substrates'20107,688,063'Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies'20107,671,614'Apparatus and method for adjusting an orientation of probes'20107,658,831'Three dimensional microstructures and methods for making three dimensional microstructures'20107,622,935'Probe card assembly with a mechanically decoupled wiring substrate'20097,592,821'Apparatus and method for managing thermally induced motion of a probe card assembly'20097,471,094'Method and apparatus for adjusting a multi-substrate probe structure'20087,471,078'Stiffener assembly for use with testing devices'20087,368,930'Adjustment mechanism'20087,285,968'Apparatus and method for managing thermally induced motion of a probe card assembly'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2017Patents assigned to FORMFACTOR INC (30)· patent assignee history
2007–2021Based in Livermore, CA, US· patent location history
2012–2017Patents assigned to HOBBS ERIC D (9)· patent assignee history
2012–2017Patents assigned to GRITTERS JOHN K (2)· patent assignee history
2013–2017Patents assigned to BREINLINGER KEITH J (3)· patent assignee history
2017–2021Patents assigned to BERKELEY LIGHTS INC (10)· patent assignee history
2017Based in Livemore, CA, US· patent location history
2020Based in Emeryville, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FORMFACTOR INC | 30 | 2007–2017 |
| BERKELEY LIGHTS INC | 10 | 2017–2021 |
| HOBBS ERIC Dself | 9 | 2012–2017 |
| BREINLINGER KEITH J | 3 | 2013–2017 |
| GRITTERS JOHN K | 2 | 2012–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Livermore, California, US | 39 | 2007–2021 |
| Emeryville, California, US | 1 | 2020 |
| Livemore, California, US | 1 | 2017 |