Inventor
ANKUR AGGARWAL
Inventor
US
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus23%
G01KMeasuring temperature13%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H01LSemiconductor devices10%
H04BTransmission9%
H10BElectronic memory devices6%
H10DInorganic electric semiconductor devices4%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
G06FElectric digital data processing2%
PatentTitleYear
12,571,971Converting processing dimensions of a wafer package202612,566,305Preserving access to edge coupling components on a wafer package202612,568,809Via formed using a partial plug that stops before a substrate202612,525,595Electrical bridge package with integrated off-bridge photonic channel interface202612,493,155Preserving access to optical components on a wafer package with sacrificial cap202512,494,403Preserving access to optical components on a wafer package with sacrificial die202512,468,103Optically bridged multicomponent package with extended temperature range202512,442,997Optically bridged multicomponent package with extended temperature range202512,442,998Optically bridged multicomponent package with extended temperature range202512,442,999Optically bridged multicomponent package with extended temperature range202512,443,000Optically bridged multicomponent package with extended temperature range202512,436,346Optically bridged multicomponent package with extended temperature range202512,405,434Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute202512,399,333Optical multi-die interconnect bridge with electrical and optical interfaces202512,394,256Method(s) and system(s) to enable an improved automated assistant suggestion service for vehicle(s)202512,392,974Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute202512,298,608Optically bridged multicomponent package with extended temperature range202512,283,584Electrical bridge package with integrated off-bridge photonic channel interface202512,242,122Multicomponent photonically intra-die bridged assembly202512,216,318Optical bridging element for separately stacked electrical ICs202512,197,023Manufacturing optically accessible co-packaged optics202512,191,257Electrical bridge package with integrated off-bridge photonic channel interface202512,189,198Manufacturing optically accessible co-packaged optics202512,172,650On-device generation and personalization of automated assistant suggestion(s) via an in-vehicle computing device202412,164,162Multicomponent photonically bridged assembly202412,164,161Stacked-dies optically bridged multicomponent package202412,124,095Optical multi-die interconnect bridge with optical interface202411,835,777Optical multi-die interconnect bridge (OMIB)202311,778,025Cross-region directory service2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to CELESTIAL AI INC (26)· patent assignee history
2023Patents assigned to AMAZON TECH INC (1)· patent assignee history
2023–2026Based in US· patent location history
2024–2025Patents assigned to GOOGLE LLC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CELESTIAL AI INC | 26 | 2023–2026 |
| GOOGLE LLC | 2 | 2024–2025 |
| AMAZON TECH INC | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 29 | 2023–2026 |