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Inventor

Kazuaki Hashimoto

Inventor
Tokyo, JP

Overview

49→
Patents
1987–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 49 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C03Cprimary
C03CChemical composition of glasses, glazes or vitreous enamels16%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation14%
H01LSemiconductor devices13%
H04NPictorial communication, e.g. television8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
Y10TTechnical subjects covered by former us classification6%
C03BManufacture, shaping, or supplementary processes5%
G11BInformation storage based on relative movement between record carrier and transducer5%
G01NInvestigating or analysing materials by determining their chemical or physical properties5%
Y02PClimate change mitigation technologies in the production or processing of goods3%
PatentTitleYear
10,797,096Semiconductor image sensor202010,672,812Image sensor202010,651,220Narrow band filter with high transmission202010,651,225Band-pass filter for stacked sensor202010,510,795Semiconductor image sensor201910,510,797Semiconductor image sensor201910,510,788Semiconductor image sensor201910,510,794Semiconductor image sensor201910,367,023Semiconductor image sensor201910,347,675Image sensor and image processing method using the same201910,134,794Image sensor chip sidewall interconnection201810,116,871Tunnel lining surface inspection system and vehicle used for tunnel lining surface inspection system20189,929,198'Infrared image sensor'20189,899,443'Complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) package with an image buffer'20189,869,064'Device for inspecting shape of road travel surface'20189,810,642'Tunnel lining surface inspection system and vehicle used in tunnel lining surface inspection system'20179,780,134'Semiconductor device and method of forming the same'20179,634,053'Image sensor chip sidewall interconnection'20179,609,239'Infrared image sensor'20179,552,831'Method for detecting abnormal sound and method for judging abnormality in structure by use of detected value thereof, and method for detecting similarity between oscillation waves and method for recognizing voice by use of detected value thereof'20179,536,915'Image sensor with embedded infrared filter layer'20179,434,644'Cover glass and method for producing cover glass'20169,374,538'Image sensor with embedded infrared filter layer'20169,096,463'Glass substrate'20159,040,147'Cover glass for a mobile device'20159,007,878'Glass for magnetic recording medium substrate and usage thereof'20158,919,150'Method of manufacturing an ion-exchanged glass article'20148,885,447'Glass for magnetic recording medium substrate, glass substrate for magnetic recording medium, and their use'20148,840,997'Cover glass and method for producing same'20148,824,248'Glass for magnetic recording medium substrate and usage thereof'20148,813,520'Glass substrate and method for manufacturing the same'20148,787,980'Glass substrate of cover glass for portable electronic device, image display unit for portable electronic device, portable electronic device and method of manufacturing glass substrate of cover glass for portable electronic device'20148,725,430'Method and apparatus for determining structural damage depth, and method and apparatus for determining structural damage treatment'20148,642,175'Glass substrate and method for manufactring the same'20148,496,373'Method of infrared inspection for structure, test specimen for infrared inspection and heat conductive member'20138,462,990'Infrared-ray thermal image analyzer'20138,384,469'Voltage divider circuit and semiconductor device'20136,776,007'Method of molding a glass composition into an optical element'20046,588,231'Method molding a glass composition into an optical element with reduced pull-out'20036,521,915'Light-emitting diode device'20036,465,105'WDM optical filter and glass substrate for use in the WDM optical filter'20026,332,338'Method of producing glass substrate for information recording medium'20016,312,841'Substrate for information recording medium and method of producing it, and information recording medium comprising the substrate'20016,151,915'Method of producing a glass optical element capable of suppressing occurrence of a damage of a mold and improving a quality of the glass optical element'20006,127,297'Optical glass having a low specific gravity'20005,997,977'Information recording substrate and information recording medium prepared from the substrate'19995,919,718'Glass composition moldable into an optical element with reduced pull-out'19995,744,409'Optical glass'19984,684,329'Canned motor pump'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–2015Based in Tokyo, JP· patent location history
1998–2016Patents assigned to HOYA CORP (21)· patent assignee history
2013–2016Patents assigned to HASHIMOTO KAZUAKI (12)· patent assignee history
2013–2018Patents assigned to WEST NIPPON EXPRESSWAY ENGINEERING SHIKOKU COMPANY LTD (5)· patent assignee history
2013–2014Patents assigned to AKASHI YUKIO (3)· patent assignee history
2013–2018Based in Takamatsu, JP· patent location history
2014–2016Based in Akiruno, JP· patent location history
2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (18)· patent assignee history
2016–2020Based in Zhubei City, TW· patent location history
2017–2020Based in Hsinchu County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HOYA CORP211998–2016
TAIWAN SEMICONDUCTOR MFG CO LTD182016–2020
HASHIMOTO KAZUAKIself122013–2016
WEST NIPPON EXPRESSWAY ENGINEERING SHIKOKU COMPANY LTD52013–2018
AKASHI YUKIO32013–2014
Locations
LocationPatentsSpan
Tokyo, JP151987–2015
Hsinchu County, TW92017–2020
Zhubei City, TW92016–2020
Takamatsu, JP72013–2018
Akiruno, JP32014–2016