LexDanaLexDanabeta
Inventor

Hiroshi Hozoji

Inventor
Hitachi, JP

Overview

61→
Patents
1991–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 61 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H05KPrinted circuits23%
H10DInorganic electric semiconductor devices13%
Y10TTechnical subjects covered by former us classification8%
H01LSemiconductor devices4%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems4%
B60LPropulsion of electrically-propelled vehicles3%
Y02TClimate change mitigation technologies related to transportation3%
H02PControl or regulation of electric motors, electric generators or dynamo-electric converters2%
B23KSoldering or unsoldering2%
PatentTitleYear
10,580,561Transformer and power converter202010,559,509Insulating substrate and semiconductor device using same202010,348,214Power module, power converter device, and electrically powered vehicle20199,729,076'Power module, power converter device, and electrically powered vehicle'20179,407,163'Power module, power converter device, and electrically powered vehicle'20169,373,558'Resin-sealed electronic control device'20168,975,747'Wiring material and semiconductor module using the same'20158,946,567'Power module, power converter device, and electrically powered vehicle'20158,847,374'Power semiconductor module and manufacturing method thereof'20148,821,768'Bonding method and bonding material using metal particle'20148,821,676'Low temperature bonding material comprising coated metal nanoparticles, and bonding method'20148,723,306'Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing method'20148,472,188'Semiconductor power module, inverter, and method of manufacturing a power module'20138,313,983'Fabrication method for resin-encapsulated semiconductor device'20128,050,037'Electronic control device using LC module structure'20117,964,975'Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them'20117,955,411'Low temperature bonding material comprising metal particles and bonding method'20117,816,786'Semiconductor unit, and power conversion system and on-vehicle electrical system using the same'20107,589,400'Inverter and vehicle drive unit using the same'20097,542,317'Semiconductor device and power conversion apparatus using the same'20097,528,485'Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device'20097,504,720'Semiconductor unit, and power conversion system and on-vehicle electrical system using the same'20097,425,762'Electronic apparatus'20087,393,771'Method for mounting an electronic part on a substrate using a liquid containing metal particles'20087,172,130'Electronic device, rubber product, and methods for manufacturing the same'20077,145,231'Electronic apparatus'20067,084,498'Semiconductor device having projected electrodes and structure for mounting the same'20067,057,283'Semiconductor device and method for producing the same'20067,002,250'Semiconductor module'20066,930,388'Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure'20056,919,622'Semiconductor device'20056,822,317'Semiconductor apparatus including insulating layer having a protrusive portion'20046,791,178'Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices'20046,780,748'Method of fabricating a wafer level chip size package utilizing a maskless exposure'20046,770,547'Method for producing a semiconductor device'20046,744,135'Electronic apparatus'20046,720,208'Semiconductor device'20046,624,504'Semiconductor device and method for manufacturing the same'20036,610,934'Semiconductor module and method of making the device'20036,531,760'Semiconductor device'20036,326,681'Semiconductor device'20016,303,982'Semiconductor device'20016,204,552'Semiconductor device'20016,130,114'Semiconductor device'20006,124,629'Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip'20006,100,580'Semiconductor device having all outer leads extending from one side of a resin member'20006,100,115'Semiconductor device'20006,081,023'Semiconductor device'20006,072,231'Semiconductor device'20006,069,029'Semiconductor device chip on lead and lead on chip manufacturing'20006,018,191'Semiconductor device'20005,981,315'Semiconductor device'19995,914,530'Semiconductor device'19995,863,817'Semiconductor device'19995,821,606'Semiconductor device'19985,793,099'Semiconductor device'19985,612,569'Semiconductor device'19975,530,286'Semiconductor device'19965,358,904'Semiconductor device'19945,225,499'Resin composition for encapsulating of semiconductor and semiconductor apparatus using of the same'19935,068,712'Semiconductor device'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2020Patents assigned to HITACHI LTD (46)· patent assignee history
1991–2005Based in Hitachi, JP· patent location history
2003–2006Based in Yokohama, JP· patent location history
2004–2006Patents assigned to RENESAS TECH CORP (7)· patent assignee history
2004–2019Based in Hitachiota, JP· patent location history
2004–2010Based in Hitachiohta, JP· patent location history
2012–2015Patents assigned to HOZOJI HIROSHI (8)· patent assignee history
2014–2019Patents assigned to HITACHI AUTOMOTIVE SYSTEMS LTD (6)· patent assignee history
2014Patents assigned to IDE EIICHI (3)· patent assignee history
2015–2020Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI LTD461991–2020
HOZOJI HIROSHIself82012–2015
RENESAS TECH CORP72004–2006
HITACHI AUTOMOTIVE SYSTEMS LTD62014–2019
IDE EIICHI32014
Locations
LocationPatentsSpan
Hitachi, JP241991–2005
Hitachiota, JP182004–2019
Yokohama, JP92003–2006
Hitachiohta, JP62004–2010
Tokyo, JP42015–2020