Inventor

Tomohisa Konno

Inventor
Tokyo, JP

Overview

18→
Patents
2003–2013
Patent span
Chemistry
Primary field (CPC C)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
C08LCompositions of macromolecular compounds15%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients13%
H10DInorganic electric semiconductor devices9%
C09GPolishing compositions7%
B24BMachines, devices, or processes for grinding or polishing4%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds4%
C09KMaterials for miscellaneous applications, not provided for elsewhere4%
Y02TClimate change mitigation technologies related to transportation4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
8,574,330'Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device'20138,524,606'Chemical mechanical planarization with overburden mask'20138,513,127'Chemical mechanical planarization processes for fabrication of FinFET devices'20138,507,383'Fabrication of replacement metal gate devices'20138,497,210'Shallow trench isolation chemical mechanical planarization'20137,498,294'Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device'20097,378,349'Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method'20087,183,211'Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing'20076,977,286'Crosslinked rubber particles and rubber compositions'20056,832,949'Window member for chemical mechanical polishing and polishing pad'20046,747,095'Crosslinked rubber particles and rubber compositions'20046,740,704'Methods for producing diene-based rubber/inorganic compound complexes and rubber compositions containing the same'20046,727,307'Rubber composition'20046,703,470'Conjugated diene-based rubber, oil extended rubber and rubber composition containing the same'20046,699,935'Rubber composition'20046,653,404'Rubber compositions'20036,562,929'Conjugated diene-based rubber and method of producing the same, oil extended rubber and rubber composition containing the same'20036,559,219'Rubber compositions'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2013Patents assigned to JSR CORP (16)· patent assignee history
2003–2007Based in Tokyo, JP· patent location history
2004–2013Based in Mie, JP· patent location history
2004–2009Based in Chuo-ku, JP· patent location history
2013Patents assigned to KONNO TOMOHISA (5)· patent assignee history
2013Patents assigned to CHARNS LESLIE (4)· patent assignee history
2013Patents assigned to CUMMINGS JASON E (4)· patent assignee history
2013Patents assigned to HUPKA LUKASZ J (4)· patent assignee history
2013Based in Yokkaichi, JP· patent location history
2013Based in Mei, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
JSR CORP162003–2013
KONNO TOMOHISAself52013
CHARNS LESLIE42013
CUMMINGS JASON E42013
HUPKA LUKASZ J42013
Locations
LocationPatentsSpan
Tokyo, JP92003–2007
Mie, JP42004–2013
Chuo-ku, JP32004–2009
Yokkaichi, JP12013
Mei, JP12013