Inventor
Chao-Ta Huang
Inventor
Hsinchu, TW
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices23%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems7%
G01CMeasuring distances, levels or bearings6%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure5%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers5%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
G01RMeasuring electric variables4%
H03HImpedance networks, e.g. resonant circuits4%
PatentTitleYear
10,927,596Window shade and its spring drive system202110,843,919Microelectromechanical system apparatus with heater202010,794,682Ball screw with tilt detector202010,730,744MEMS device with movable stage202010,703,625Microelectromechanical system (MEMS) apparatus with adjustable spring202010,631,368Micro-electromechanical temperature control system with thermal reservoir202010,622,996Adjustable sensing capacitance microelectromechanical system (MEMS) apparatus202010,436,654Interaction force detection apparatus201910,393,718Micro-electromechanical apparatus for thermal energy control201910,203,252Microelectromechanical apparatus having a measuring range selector201910,132,877Micro-electromechanical apparatus with pivot element201810,011,476MEMS apparatus having impact absorber20189,841,281'Micro-electromechanical apparatus utilizing folded spring for rotary element'20179,586,815'Micro-electromechanical apparatus with multiple chambers and method for manufacturing the same'20179,529,012'Micro-electro mechanical apparatus with interdigitated spring'20169,382,112'Manufacturing methods for micro-electromechanical system device having electrical insulating structure'20169,369,788'MEMS microphone package'20169,249,008'MEMS device with multiple electrodes and fabricating method thereof'20169,238,576'Composite micro-electro-mechanical-system apparatus and manufacturing method thereof'20169,227,841'Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same'20169,227,840'Micro-electro mechanical apparatus with PN-junction'20169,051,170'Microelectromechanical system device with electrical interconnections and method for fabricating the same'20159,046,367'Micro-electro-mechanical-system device with oscillating assembly'20158,809,972'Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same'20148,695,426'Micro-electromechanical system device having electrical insulating structure and manufacturing methods'20148,693,711'Capacitive transducer and fabrication method'20148,421,543'Crystal oscillator and method for manufacturing the same'20138,104,354'Capacitive sensor and manufacturing method thereof'20127,923,791'Package and packaging assembly of microelectromechanical system microphone'20117,868,402'Package and packaging assembly of microelectromechanical system microphone'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2020Patents assigned to IND TECH RES INST (29)· patent assignee history
2011–2020Based in Hsinchu, TW· patent location history
2012–2016Patents assigned to HSU YU WEN (4)· patent assignee history
2012–2016Patents assigned to HUANG CHAO TA (4)· patent assignee history
2013–2015Patents assigned to HUANG CHAO-TA (4)· patent assignee history
2013–2015Patents assigned to HSU YU-WEN (3)· patent assignee history
2014Based in Hsingchu, TW· patent location history
2021Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IND TECH RES INST | 29 | 2011–2020 |
| HSU YU WEN | 4 | 2012–2016 |
| HUANG CHAO TAself | 4 | 2012–2016 |
| HUANG CHAO-TAself | 4 | 2013–2015 |
| HSU YU-WEN | 3 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 28 | 2011–2020 |
| New Taipei, TW | 1 | 2021 |
| Hsingchu, TW | 1 | 2014 |