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Inventor

TRACY MICHELLE RAGAN

Inventor
US

Overview

2→
Patents
2022
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
B24BMachines, devices, or processes for grinding or polishing13%
C09GPolishing compositions13%
C09KMaterials for miscellaneous applications, not provided for elsewhere13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
PatentTitleYear
11,367,649Semiconductor substrate polishing methods202211,355,346Methods for processing semiconductor wafers having a polycrystalline finish2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022Patents assigned to GLOBALWAFERS CO LTD (2)· patent assignee history
2022Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
GLOBALWAFERS CO LTD22022
Locations
LocationPatentsSpan
US22022