Inventor
KLAUS REINGRUBER
Inventor
DE
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10HInorganic light-emitting semiconductor devices having potential barriers13%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light7%
H10DInorganic electric semiconductor devices7%
PatentTitleYear
11,955,462Package stacking using chip to wafer bonding202411,715,820Optoelectronic component and method for producing an optoelectronic component202311,670,745Method for producing optoelectronic semiconductor components, and optoelectronic semiconductor component202311,469,213Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics202211,424,209Wafer level package structure with internal conductive layer202211,239,199Package stacking using chip to wafer bonding2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to INTEL CORP (4)· patent assignee history
2022–2024Based in DE· patent location history
2023Patents assigned to OSRAM OLED GMBH (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 4 | 2022–2024 |
| OSRAM OLED GMBH | 2 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 6 | 2022–2024 |