Inventor
JIMING LI
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H01QAntennas, i.e. radio aerials17%
PatentTitleYear
12,412,845Semiconductor packages and methods of manufacturing the same202512,308,306Semiconductor device package and method of manufacturing the same202511,824,031Semiconductor package structure with dielectric structure covering upper surface of chip202311,658,102Semiconductor device package and method of manufacturing the same202311,552,026Semiconductor packages and methods of manufacturing the same2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to ADVANCED SEMICONDUCTOR ENG (5)· patent assignee history
2023–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 5 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2023–2025 |