Inventor
MASARU HARAGUCHI
Inventor
JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10BElectronic memory devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
G11CStatic stores11%
G06FElectric digital data processing5%
H01GCapacitors5%
H10DInorganic electric semiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
12,340,838Drive circuit with improved timing margin for memory device202512,317,521Capacitor device and manufacturing method therefor202512,074,103Circuit assembly202411,417,628Method for manufacturing semiconductor structure202211,380,614Circuit assembly202211,200,945Semiconductor memory device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to ZENTEL JAPAN CORP (1)· patent assignee history
2021–2025Based in JP· patent location history
2022–2025Patents assigned to AP MEMORY TECH CORP (3)· patent assignee history
2022Patents assigned to AP MEMORY TECH CORPORATION (1)· patent assignee history
2025Patents assigned to AP MEMORY TECH HANGZHOU LIMITED CO (1)· patent assignee history
2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AP MEMORY TECH CORP | 3 | 2022–2025 |
| AP MEMORY TECH CORPORATION | 1 | 2022 |
| AP MEMORY TECH HANGZHOU LIMITED CO | 1 | 2025 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 1 | 2025 |
| ZENTEL JAPAN CORP | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 5 | 2021–2025 |
| TW | 1 | 2025 |