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Inventor

Ravindra Vaman Shenoy

Inventor
Dublin, CA, US

Overview

66→
Patents
1995–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 66 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H01LSemiconductor devices10%
H10NElectric solid-state devices not otherwise provided for8%
Y10TTechnical subjects covered by former us classification8%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems5%
H10DInorganic electric semiconductor devices4%
G01CMeasuring distances, levels or bearings4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock3%
PatentTitleYear
11,115,576Sensor module with a collar configured to be attached to a camera module for a user device202110,867,740Inductor apparatus and method of fabricating202010,770,646Manufacturing method for flexible PMUT array202010,735,865Transducer with piezoelectric, conductive and dielectric membrane202010,734,332High aspect ratio interconnects in air gap of antenna package202010,722,918Release hole plus contact via for fine pitch ultrasound transducer integration202010,685,924Antenna-on-package arrangements202010,618,079Piezoelectric micromechanical ultrasonic transducers and transducer arrays202010,569,302Biometric sensor with force detection and ultrasonic imaging capability202010,497,748Integrated piezoelectric micromechanical ultrasonic transducer pixel and array201910,490,880Glass-based antenna array package201910,478,858Piezoelectric ultrasonic transducer and process201910,470,309Inductor and capacitor integrated on a substrate201910,209,072Stacked lateral overlap transducer (SLOT) based three-axis accelerometer201910,199,152Embedded thin film magnetic carrier for integrated voltage regulator201910,115,671Incorporation of passives and fine pitch through via for package on package201810,109,784Sensor device201810,003,888Transducer with piezoelectric, conductive and dielectric membrane201810,001,552Three-port piezoelectric ultrasonic transducer20189,773,862'High quality factor capacitors and methods for fabricating high quality factor capacitors'20179,605,965'Micromachined piezoelectric x-axis gyroscope'20179,548,350'High quality factor capacitors and methods for fabricating high quality factor capacitors'20179,510,454'Integrated interposer with embedded active devices'20169,496,213'Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate'20169,459,099'Micromachined piezoelectric x-axis gyroscope'20169,410,805'Micromachined piezoelectric z-axis gyroscope'20169,337,799'Selective tuning of acoustic devices'20169,331,666'Composite dilation mode resonators'20169,325,420'Electro-optical transceiver device to enable chip-to-chip interconnection'20169,293,245'Integration of a coil and a discontinuous magnetic core'20169,263,370'Semiconductor device with via bar'20169,190,208'Metal-insulator-metal capacitors on glass substrates'20159,178,256'Isotropically-etched cavities for evanescent-mode electromagnetic-wave cavity resonators'20159,105,602'Embedded three-dimensional capacitor'20159,045,332'Thin back glass interconnect'20159,032,796'Stacked lateral overlap transducer (SLOT) based three-axis accelerometer'20159,021,880'Micromachined piezoelectric three-axis gyroscope and stacked lateral overlap transducer (slot) based three-axis accelerometer'20159,000,656'Microelectromechanical system device including a metal proof mass and a piezoelectric component'20158,970,516'Integrated passives and power amplifier'20158,896,521'Metal-insulator-metal capacitors on glass substrates'20148,884,725'In-plane resonator structures for evanescent-mode electromagnetic-wave cavity resonators'20148,811,636'Microspeaker with piezoelectric, metal and dielectric membrane'20148,742,570'Backplate interconnect with integrated passives'20148,724,038'Wraparound assembly for combination touch, handwriting and fingerprint sensor'20148,584,522'Micromachined piezoelectric x-axis gyroscope'20138,516,887'Micromachined piezoelectric z-axis gyroscope'20138,516,886'Micromachined piezoelectric X-Axis gyroscope'20137,825,674'Probe card configuration for low mechanical flexural strength electrical routing substrates'20107,482,822'Apparatus and method for limiting over travel in a probe card assembly'20097,326,327'Rhodium electroplated structures and methods of making same'20087,084,650'Apparatus and method for limiting over travel in a probe card assembly'20067,071,715'Probe card configuration for low mechanical flexural strength electrical routing substrates'20066,238,589'Methods for monitoring components in the TiW etching bath used in the fabrication of C4s'20015,939,223'Lithium polymer electrolyte battery for sub-ambient temperature applications'19995,800,726'Selective chemical etching in microelectronics fabrication'19985,796,168'Metallic interconnect pad, and integrated circuit structure using same, with reduced undercut'19985,759,437'Etching of Ti-W for C4 rework'19985,620,611'Method to improve uniformity and reduce excess undercuts during chemical etching in the manufacture of solder pads'19975,567,304'Elimination of island formation and contact resistance problems during electroetching of blanket or patterned thin metallic layers on insulating substrate'19965,558,957'Method for making a thin flexible primary battery for microelectronics applications'19965,543,032'Electroetching method and apparatus'19965,536,388'Vertical electroetch tool nozzle and method'19965,486,282'Electroetching process for seed layer removal in electrochemical fabrication of wafers'19965,462,638'Selective etching of TiW for C4 fabrication'19955,456,788'Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process'19955,445,705'Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2001Patents assigned to IBM (14)· patent assignee history
1995–1998Based in Peekskill, NY, US· patent location history
1997–1998Based in Westchester, NY, US· patent location history
1998–1999Based in Santa Barbara, CA, US· patent location history
2006–2021Based in Dublin, CA, US· patent location history
2013–2018Patents assigned to QUALCOMM MEMS TECHNOLOGIES INC (23)· patent assignee history
2013–2015Patents assigned to STEPHANOU PHILIP JASON (9)· patent assignee history
2013–2015Based in San Jose, CA, US· patent location history
2014–2015Patents assigned to SHENOY RAVINDRA V (8)· patent assignee history
2015–2021Patents assigned to QUALCOMM INC (22)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
QUALCOMM MEMS TECHNOLOGIES INC232013–2018
QUALCOMM INC222015–2021
IBM141995–2001
STEPHANOU PHILIP JASON92013–2015
SHENOY RAVINDRA Vself82014–2015
Locations
LocationPatentsSpan
Dublin, California, US462006–2021
Peekskill, New York, US91995–1998
San Jose, California, US62013–2015
Santa Barbara, California, US21998–1999
Westchester, New York, US21997–1998