LexDanaLexDanabeta
Inventor

Hiroyuki Handa

Inventor
Osaka, JP

Overview

47→
Patents
1980–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 47 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
Y10TTechnical subjects covered by former us classification8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems6%
H01GCapacitors5%
B23KSoldering or unsoldering5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
H02JElectric power networks4%
B25JManipulators3%
PatentTitleYear
10,737,817Method, apparatus, and system for robotic article handling202010,483,966Switching circuit201910,205,449Switching circuit20199,971,019System and method for through-the-wall-radar-imaging using total-variation denoising20189,484,342'Semiconductor apparatus'20169,409,334'Injection molding machine with purge shield'20168,660,697'Shape detection system'20148,457,792'Shape detection system'20138,260,463'Robot system'20128,210,145'Engine start device'20127,839,128'Bidirectional power supply device'20107,830,035'Power supply unit'20107,816,806'Power supply device'20107,679,337'Power supply system'20107,248,245'Liquid crystal display device and manufacturing method thereof, and drive control method of lighting unit'20077,247,178'Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same'20077,140,104'Method of producing circuit component built-in module with embedded circuit component'20067,126,811'Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same'20067,127,325'Controllable object remote control and diagnosis apparatus'20067,088,334'Liquid crystal display device and manufacturing method thereof, and drive control method of lighting unit'20067,057,896'Power module and production method thereof'20067,038,310'Power module with improved heat dissipation'20066,882,130'Battery-driven electronic device and mobile communication apparatus'20056,872,915'High speed carbon dioxide gas welding method'20056,863,962'Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same'20056,850,401'DC-DC converter'20056,836,401'Capacitor, laminated capacitor, and capacitor built-in-board'20046,831,250'Method for calculating shape of bead of welded part'20046,787,884'Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production'20046,768,409'Magnetic device, method for manufacturing the same, and power supply module equipped with the same'20046,750,428'Automatic welding device and welding skill training device'20046,666,392'Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same'20036,642,483'High-speed CO2 gas welding method'20036,639,471'Power amplifier circuit, control method for power amplifier circuit, and portable terminal apparatus for mobile communication'20036,570,099'Thermal conductive substrate and the method for manufacturing the same'20036,548,152'Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same'20036,504,705'Electrolytic capacitor, circuit board containing electrolytic capacitor, and method for producing the same'20036,473,293'Capacitor unit, method for producing the same, and solid electrolytic capacitor'20026,358,351'Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same'20026,355,131'Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same'20026,329,045'Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same'20016,096,994'Automatic welding condition setting device'20006,060,150'Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same'20005,783,921'Welding robot with base stand having self contained welding power source'19985,774,345'Switching power supply with surge current and surge voltage prevention'19985,398,266'Superconductive apparatus'19954,204,298'Compact vacuum cleaner'1980

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1980–2014Patents assigned to HANDA HIROYUKI (4)· patent assignee history
1980–2018Based in Kanagawa, JP· patent location history
1998–2007Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (23)· patent assignee history
1998–2014Patents assigned to YASKAWA DENKI SEISAKUSHO KK (9)· patent assignee history
1998–2007Based in Hirakata, JP· patent location history
1998–2005Based in Kitakyushu, JP· patent location history
2000–2019Based in Osaka, JP· patent location history
2006–2014Based in Fukuoka, JP· patent location history
2010–2012Patents assigned to PANASONIC CORP (5)· patent assignee history
2016–2019Patents assigned to PANASONIC IP MAN CO LTD (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD231998–2007
YASKAWA DENKI SEISAKUSHO KK91998–2014
PANASONIC CORP52010–2012
HANDA HIROYUKIself41980–2014
PANASONIC IP MAN CO LTD32016–2019
Locations
LocationPatentsSpan
Osaka, JP182000–2019
Hirakata, JP141998–2007
Kitakyushu, JP51998–2005
Fukuoka, JP42006–2014
Kanagawa, JP21980–2018