Inventor
DEEPIKA PRIYADARSHINI
Inventor
US
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
C23CCoating metallic material14%
PatentTitleYear
11,804,405Method of forming copper interconnect structure with manganese barrier layer202311,232,983Copper interconnect structure with manganese barrier layer202211,186,911Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to IBM (1)· patent assignee history
2021–2023Based in US· patent location history
2022Patents assigned to TESSERA INC (1)· patent assignee history
2023Patents assigned to TESSERA LLC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 1 | 2021 |
| TESSERA INC | 1 | 2022 |
| TESSERA LLC | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 3 | 2021–2023 |