LexDanaLexDanabeta
Inventor

TZU-HSUAN YEH

Inventor
TW

Overview

5→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H10BElectronic memory devices12%
H10NElectric solid-state devices not otherwise provided for12%
PatentTitleYear
12,218,005Integrated circuit device202512,165,996Bond pad with enhanced reliability202411,894,267Method for fabricating integrated circuit device202411,824,022Bond pad with enhanced reliability202311,244,914Bond pad with enhanced reliability2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2022–2025Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD52022–2025
Locations
LocationPatentsSpan
TW52022–2025