Inventor
Gen Murakami
Inventor
Machida, JP
Overview
Patents· 81 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H05KPrinted circuits17%
Y10TTechnical subjects covered by former us classification12%
H10DInorganic electric semiconductor devices11%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
LOCD13%
G11CStatic stores1%
PatentTitleYear
7,476,913'Light emitting device having a mirror portion'20097,317,181'Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit'20086,995,510'Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit'20066,981,585'Surface package type semiconductor package and method of producing semiconductor memory'20066,919,622'Semiconductor device'20056,855,893'Wiring board, semiconductor device, electronic device, and circuit board for electronic parts'20056,720,208'Semiconductor device'20046,531,760'Semiconductor device'20036,443,298'Surface package type semiconductor package and method of producing semiconductor memory'20026,433,409'Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same'20026,426,548'Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same'2002RE037539'Sealed stacked arrangement of semiconductor devices'20026,326,681'Semiconductor device'20016,303,982'Semiconductor device'20016,297,142'Method for bonding a semiconductor chip to a lead-patterning substrate using a gold/tin alloy'20016,223,893'Surface package type semiconductor package and method of producing semiconductor memory'20016,204,552'Semiconductor device'20016,130,114'Semiconductor device'20006,124,629'Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip'20006,114,751'Semiconductor device and electronic device'20006,100,580'Semiconductor device having all outer leads extending from one side of a resin member'20006,100,115'Semiconductor device'20006,081,023'Semiconductor device'20006,072,231'Semiconductor device'20006,069,029'Semiconductor device chip on lead and lead on chip manufacturing'20006,030,859'Method of making a packaged semiconductor device and a lead-frame therefor'20006,031,292'Semiconductor device, interposer for semiconductor device'20006,018,191'Semiconductor device'20006,002,167'Semiconductor device having lead on chip structure'19995,988,368'Resist pattern forming method using anti-reflective layer resist pattern formed and method of etching using resist pattern and product formed'19995,981,315'Semiconductor device'19995,914,530'Semiconductor device'19995,869,888'Semiconductor device with lead structure on principal surface of chip'19995,866,948'Interposer for semiconductor device'19995,863,817'Semiconductor device'19995,821,606'Semiconductor device'19985,803,246'Surface package type semiconductor package and method of producing semiconductor memory'19985,793,099'Semiconductor device'19985,742,101'Semiconductor device'19985,714,405'Semiconductor device'19985,701,031'Sealed stacked arrangement of semiconductor devices'19975,648,299'Packaged semiconductor device and a leadframe therefor'19975,612,569'Semiconductor device'19975,607,059'Surface package type semiconductor package and method of producing semiconductor memory'19975,585,665'Packaged semiconductor device and a leadframe therefor'19965,583,375'Semiconductor device with lead structure within the planar area of the device'19965,530,286'Semiconductor device'19965,514,905'Semiconductor device'19965,448,105'Semiconductor device having a leadframe and metal substrate'19955,442,233'Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation'19955,365,113'Semiconductor device'19945,358,904'Semiconductor device'19945,357,139'Plastic encapsulated semiconductor device and lead frame'19945,332,922'Multi-chip semiconductor package'19945,304,844'Semiconductor device and method of producing the same'19945,295,297'Method of producing semiconductor memory'19945,296,737'Semiconductor device with a plurality of face to face chips'19945,274,914'Method of producing surface package type semiconductor package'19945,256,903'Plastic encapsulated semiconductor device'19935,235,207'Semiconductor device'19935,194,935'Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure'19935,184,208'Semiconductor device'19935,150,193'Resin-encapsulated semiconductor device having a particular mounting structure'19925,095,626'Method of producing semiconductor memory packages'19925,068,712'Semiconductor device'19915,032,895'Semiconductor device and method of producing the same'19914,994,411'Process of producing semiconductor device'19914,989,068'Semiconductor device and method of manufacturing the same'19914,987,474'Semiconductor device and method of manufacturing the same'19914,971,196'Surface package type semiconductor package'19904,951,122'Resin-encapsulated semiconductor device'19904,707,724'Semiconductor device and method of manufacturing thereof'19874,706,105'Semiconductor device and method of producing the same'19874,691,225'Semiconductor device and a method of producing the same'19874,301,464'Lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting member'1981D0260986'Semiconductor'1981D0260091'Semiconductor'1981D0259783'Semiconductor'1981D0259782'Semiconductor'1981D0259560'Semiconductor'1981D0259559'Semiconductor'1981Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1981–2002Patents assigned to HITACHI LTD (66)· patent assignee history
1981–2006Based in Machida, JP· patent location history
1991–1995Patents assigned to HITACHI VLSI ENG (3)· patent assignee history
1993–2002Based in Tama, JP· patent location history
1994–2009Based in Tokyo, JP· patent location history
1995–2000Patents assigned to TEXAS INSTRUMENTS INC (4)· patent assignee history
1995Based in Kodaira, JP· patent location history
1999–2009Patents assigned to HITACHI CABLE (10)· patent assignee history
2000–2002Based in Ibaraki, JP· patent location history
2004–2009Patents assigned to RENESAS TECH CORP (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 66 | 1981–2002 |
| HITACHI CABLE | 10 | 1999–2009 |
| RENESAS TECH CORP | 4 | 2004–2009 |
| TEXAS INSTRUMENTS INC | 4 | 1995–2000 |
| HITACHI VLSI ENG | 3 | 1991–1995 |
Locations
| Location | Patents | Span |
|---|---|---|
| Machida, JP | 51 | 1981–2006 |
| Tama, JP | 15 | 1993–2002 |
| Tokyo, JP | 9 | 1994–2009 |
| Ibaraki, JP | 4 | 2000–2002 |
| Kodaira, JP | 1 | 1995 |