Inventor
WonIl Kwon
Inventor
Seoul, KR
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
PatentTitleYear
9,406,579'Semiconductor device and method of controlling warpage in semiconductor package'20169,401,289'Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces'20168,304,296'Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2016Patents assigned to KWON WONIL (3)· patent assignee history
2012Based in Song Pa Gu, KR· patent location history
2016Patents assigned to CHOI DAESIK (2)· patent assignee history
2016Patents assigned to STATS CHIPPAC PTE LTD (2)· patent assignee history
2016Patents assigned to YANG JOUNGIN (2)· patent assignee history
2016Patents assigned to KIM MINJUNG (1)· patent assignee history
2016Based in Seoul, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KWON WONILself | 3 | 2012–2016 |
| CHOI DAESIK | 2 | 2016 |
| STATS CHIPPAC PTE LTD | 2 | 2016 |
| YANG JOUNGIN | 2 | 2016 |
| KIM MINJUNG | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 2 | 2016 |
| Song Pa Gu, KR | 1 | 2012 |