Inventor
Jurgen Schulz-Harder
Inventor
Lauf, DE
Overview
Patents· 48 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
Y10TTechnical subjects covered by former us classification18%
C04BLime, magnesia10%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light3%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact2%
B23KSoldering or unsoldering1%
PatentTitleYear
9,730,310'Metal-ceramic substrate'20179,434,509'Package for metal-ceramic substrate and method for packing such substrates'20168,974,914'Metal-ceramic substrate and method for manufacturing such a substrate'20158,749,052'Electronic device'20148,683,682'Method for the production of a metal-ceramic substrate'20148,584,924'Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate'20138,559,475'Heat sink and assembly or module unit'20138,481,842'Process for producing Peltier modules, and Peltier module'20138,435,640'Metal-ceramic substrate'20138,377,240'Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method'20138,342,384'Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate'20138,130,807'Diode laser array and method for manufacturing such an array'20128,069,561'Method for manufacturing a metal-ceramic substrate'20118,056,230'Method for manufacturing plate stacks, particularly coolers or cooler elements consisting of plate stacks'20118,021,920'Method for producing a metal-ceramic substrate for electric circuits on modules'20117,940,526'Electrical module'20117,814,655'Heat sink in the form of a heat pipe and process for manufacturing such a heat sink'20107,811,655'Metal-ceramic substrate'20107,800,908'Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink'20107,750,461'Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate'20107,528,470'Conductor board and method for producing a conductor board'20097,299,967'Method for manufacturing plate stacks, particularly coolers or cooler elements made up of plate stacks'20077,187,545'Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support'20077,051,793'Cooler for electrical components'20067,036,711'PROCESS FOR THE MANUFACTURE OF METAL-CERAMIC COMPOUND MATERIAL IN PARTICULAR METAL-CERAMIC SUBSTRATES AND METAL-CERAMIC COMPOUND MATERIAL ESPECIALLY METAL-CERAMIC SUBSTRATE MANUFACTURED ACCORDING TO THIS PROCESS'20067,000,316'Conductor board and method for producing a conductor board'20066,877,869'Mirror for laser applications and method for manufacture of said mirror'20056,638,592'Ceramic/metal substrate, especially composite substrate'20036,475,401'Process for the manufacture of substrates with textured metalizations and holding and fastening elements for use in this process'20026,386,278'Cooler'20026,345,665'Cooling system'20026,345,437'Process for the manufacturing of an arched metal ceramic substratum'20026,297,469'Process for producing a metal-ceramic substrate'20016,207,221'Process for producing a metal-ceramic substrate and a metal-ceramic substrate'20016,182,358'Process for producing a metal-ceramic substrate'20016,093,443'Process for producing a ceramic-metal substrate'20006,066,219'Process for producing a ceramic substrate and a ceramic substrate'20006,014,312'Cooler or heat sink for electrical components or circuits and an electrical circuit with this heat sink'20005,987,893'Heat exchanger arrangement and cooling system with at least one such heat exchanger arrangement'19995,981,036'Metal ceramic substrate'19995,924,191'Process for producing a ceramic-metal substrate'19995,721,044'Multiple substrate'19985,676,855'Multiple substrate and process for its production'19975,527,620'Metal coated substrate having improved resistivity to cyclic temperature stress'19965,508,089'Multiple substrate and process for its production'19965,465,898'Process for producing a metal-ceramic substrate'19955,382,830'Semiconductor module with multi-plane conductive path'19955,087,505'Substrate, consisting of copper and ceramic layers, for printed circuit boards of electrical circuits'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–1995Based in Eschenbach, DE· patent location history
1995–2017Based in Lauf, DE· patent location history
1999–2017Patents assigned to CURAMIK ELECTRONICS GMBH (25)· patent assignee history
2006–2014Patents assigned to SCHULZ-HARDER JURGEN (5)· patent assignee history
2007–2010Patents assigned to ELECTROVAC AG (3)· patent assignee history
2011–2013Patents assigned to SCHULZ-HARDER JUERGEN (7)· patent assignee history
2011Based in Regensburg, DE· patent location history
2012–2015Patents assigned to MEYER ANDREAS (3)· patent assignee history
2013Based in Lauf a.d. Pegnitz, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CURAMIK ELECTRONICS GMBH | 25 | 1999–2017 |
| SCHULZ-HARDER JUERGEN | 7 | 2011–2013 |
| SCHULZ-HARDER JURGENself | 5 | 2006–2014 |
| ELECTROVAC AG | 3 | 2007–2010 |
| MEYER ANDREAS | 3 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Lauf, DE | 44 | 1995–2017 |
| Eschenbach, DE | 2 | 1992–1995 |
| Lauf a.d. Pegnitz, DE | 1 | 2013 |
| Regensburg, DE | 1 | 2011 |