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Inventor

Shinji Matsuda

Inventor
Kawasaki, JP

Overview

20→
Patents
1991–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Bprimary
H05BElectric heating13%
H05KPrinted circuits13%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
Y10TTechnical subjects covered by former us classification8%
Y02PClimate change mitigation technologies in the production or processing of goods6%
C22CAlloys4%
C22FChanging the physical structure of non-ferrous metals and non-ferrous alloys4%
A61FFilters implantable into blood vessels2%
A61JContainers specially adapted for medical or pharmaceutical purposes2%
PatentTitleYear
10,785,854Lighting system and lighting apparatus20209,480,128'Illumination control method and illumination control system and illumination system using the same'20169,451,676'Lighting control device and lighting system'20169,366,164'DPF system for an engine generator'20169,226,365'Lighting system'20158,779,667'Illumination apparatus'20148,659,230'Illumination control system'20148,490,839'Filtering dispenser container'20138,477,234'Brightness sensing system and illumination system using the same'20138,089,775'Multileveled printed circuit board unit including substrate interposed between stacked bumps'20127,489,518'Multileveled printed circuit board unit including substrate interposed between stacked bumps'20096,909,065'Altering method of circuit pattern of printed-circuit board, cutting method of circuit pattern of printed-circuit board and printed-circuit board having altered circuit pattern'20056,697,261'Multileveled printed circuit board unit including substrate interposed between stacked bumps'20046,464,805'Aluminum alloy plate excelling in filiform corrosion resistance and method of fabricating same'20026,461,454'Aluminum alloy plate for automobile and manufacturing method thereof'20026,415,504'Altering method of circuit pattern of printed-circuit board'20025,750,997'Method and apparatus for observing wiring patterns of printed circuit board'19985,550,325'Printed-circuit board including circuit pattern having location to be cut if necessary'19965,145,269'Printer with a plurality of ink ribbon cassettes having a cam lift mechanism controlled by a stepper motor'19925,031,663'Pressure control valve device'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996–2012Patents assigned to FUJITSU LTD (7)· patent assignee history
1996–2012Based in Kawasaki, JP· patent location history
2002Based in Fujisawa, JP· patent location history
2012–2014Patents assigned to MATSUDA SHINJI (5)· patent assignee history
2014–2015Patents assigned to PANASONIC CORP (3)· patent assignee history
2014Patents assigned to NANAHARA ATUO (2)· patent assignee history
2014Based in Chiba, JP· patent location history
2015–2020Patents assigned to PANASONIC IP MAN CO LTD (4)· patent assignee history
2015–2016Based in Saitama, JP· patent location history
2020Based in Osaka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJITSU LTD71996–2012
MATSUDA SHINJIself52012–2014
PANASONIC IP MAN CO LTD42015–2020
PANASONIC CORP32014–2015
NANAHARA ATUO22014
Locations
LocationPatentsSpan
Kawasaki, JP71996–2012
Saitama, JP22015–2016
Chiba, JP22014
Fujisawa, JP22002
Osaka, JP12020