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Inventor

Hirohumi Shinagawa

Inventor
Nagaokakyo, JP

Overview

2→
Patents
1993–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form17%
C09KMaterials for miscellaneous applications, not provided for elsewhere17%
H01LSemiconductor devices17%
H05KPrinted circuits17%
PatentTitleYear
10,166,747Resin multilayer substrate and method of manufacturing the same20195,241,207'Semiconductor device having an interconnected film with tapered edge'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993Patents assigned to TOSHIBA KK (1)· patent assignee history
1993Based in Kawasaki, JP· patent location history
2019Patents assigned to MURATA MANUFACTURING CO (1)· patent assignee history
2019Based in Nagaokakyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MURATA MANUFACTURING CO12019
TOSHIBA KK11993
Locations
LocationPatentsSpan
Nagaokakyo, JP12019
Kawasaki, JP11993