Inventor

Takafumi SAMESHIMA

Inventor
JP

Overview

15→
Patents
2022–2026
Patent span
Performing operations
Primary field (CPC B)

Patents· 15 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics30%
B29BPreparation or pretreatment of the material to be shaped26%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts14%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds6%
C08JWorking-up6%
B01FMixing, e.g. dissolving, emulsifying or dispersing4%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering4%
D04HMaking textile fabrics, e.g. from fibres or filamentary material4%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%
H01BCables2%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2026Patents assigned to SHIBAURA MACHINE CO LTD (12)· patent assignee history
2022–2025Patents assigned to HSP TECH INC (8)· patent assignee history
2022–2023Patents assigned to TOSHIBA MACHINE CO LTD (7)· patent assignee history
2022–2026Based in JP· patent location history
2023–2026Patents assigned to UNIV NAT CORP KANAZAWA (2)· patent assignee history
2024–2025Patents assigned to SEIKO EPSON CORP (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SHIBAURA MACHINE CO LTD122022–2026
HSP TECH INC82022–2025
TOSHIBA MACHINE CO LTD72022–2023
SEIKO EPSON CORP22024–2025
UNIV NAT CORP KANAZAWA22023–2026
Locations
LocationPatentsSpan
JP152022–2026