Inventor
Mario A. Bolanos
Inventor
Plano, TX, US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics57%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
PatentTitleYear
6,531,083'Sproutless pre-packaged molding for component encapsulation'20035,965,078'Method for manufacturing prepackaged molding compound for component encapsulation'19995,955,115'Pre-packaged liquid molding for component encapsulation'19995,949,132'Dambarless leadframe for molded component encapsulation'19995,912,024'Sproutless pre-packaged molding for component encapsulation'19995,891,377'Dambarless leadframe for molded component encapsulation'19995,888,443'Method for manufacturing prepackaged molding compound for component encapsulation'19995,885,506'Pre-packaged molding for component encapsulation'19995,644,168'Mechanical interlocking of fillers and epoxy/resin'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2003Patents assigned to TEXAS INSTRUMENTS INC (9)· patent assignee history
1997–2003Based in Plano, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 9 | 1997–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Plano, Texas, US | 9 | 1997–2003 |