Inventor
Jaehyun Lee
Inventor
Seoul, KR
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
B62DMotor vehicles8%
H10KOrganic electric solid-state devices5%
B23PMetal-working not otherwise provided for4%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein3%
G06FElectric digital data processing3%
H01JElectric discharge tubes or discharge lamps3%
PatentTitleYear
10,788,711Display device comprising a liquid crystal display panel having at least two optical compensation films including a positive biaxial film and a negative biaxial film202010,642,390Display device including a conductive portion covering an area in which clock signal lines and touch signal lines overlap202010,607,820Monitoring units, plasma treatment devices including the same, and methods of fabricating semiconductor devices using the same202010,541,279Display device202010,523,812Method and system for providing ringback tone service and ringtone service in Voice over Internet Protocol (VoIP) call service201910,497,597Electrostatic chuck assembly and substrate processing apparatus including the same201910,473,980In-plane switching mode liquid crystal display device comprising an in-cell retarder and first and second optical compensation films201910,466,823Electronic device201910,439,144Organic compound for electronic device comprising fused-core structure, organic optoelectronic device comprising same, and display device201910,096,540Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance20189,863,793'Sensor position control apparatus and method'20189,847,266Method of fabricating semiconductor device20179,817,386'Joint guarantee system for vehicle assembly and control method of the same'20179,700,970'Fastening device and control method of the same'20179,679,846'Semiconductor device and method of forming conductive layer over substrate with vents to channel bump material and reduce interconnect voids'20179,651,934'Joint guarantee system for vehicle assembly and control method of the same'20179,627,417'Method of manufacturing display apparatus and display apparatus manufactured through the method'20179,541,570'Speed measuring device for conveyor line'20179,533,403'Joint guarantee system for vehicle assembly and control method of the same'20179,460,972'Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection'20169,242,686'Joint guarantee system for vehicle assembly and control method of the same'20169,230,933'Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure'20169,202,715'Integrated circuit packaging system with connection structure and method of manufacture thereof'20159,193,358'System for informing functions of vehicle'20159,158,186'Projection display device'20159,117,812'Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability'20159,054,100'Semiconductor die and method of forming sloped surface in photoresist layer to enhance flow of underfill material between semiconductor die and substrate'20158,952,529'Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids'20158,642,384'Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability'20148,524,538'Integrated circuit packaging system with film assistance mold and method of manufacture thereof'20138,189,045'Surveillance camera'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2018Patents assigned to LEE JAEHYUN (10)· patent assignee history
2013–2017Patents assigned to STATS CHIPPAC LTD (9)· patent assignee history
2013–2015Based in Sungnam, KR· patent location history
2014–2018Patents assigned to JANG KIYOUN (4)· patent assignee history
2014–2018Patents assigned to LEE KYUNGHOON (4)· patent assignee history
2014–2018Based in Kyungki-do, KR· patent location history
2015–2018Patents assigned to HYUNDAI MOTOR CO LTD (8)· patent assignee history
2015–2020Based in Seoul, KR· patent location history
2017–2020Based in Yongin-si, KR· patent location history
2019–2020Based in Gyeonggi-do, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LEE JAEHYUNself | 10 | 2012–2018 |
| STATS CHIPPAC LTD | 9 | 2013–2017 |
| HYUNDAI MOTOR CO LTD | 8 | 2015–2018 |
| JANG KIYOUN | 4 | 2014–2018 |
| LEE KYUNGHOON | 4 | 2014–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 12 | 2015–2020 |
| Kyungki-do, KR | 8 | 2014–2018 |
| Yongin-si, KR | 3 | 2017–2020 |
| Gyeonggi-do, KR | 2 | 2019–2020 |
| Sungnam, KR | 2 | 2013–2015 |