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Inventor

Te Yun Liu

Inventor
Hsinchu, TW

Overview

2→
Patents
1998–1999
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B05Cprimary
B05CApparatus for applying fluent materials to surfaces, in general33%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
PatentTitleYear
5,857,619'Apparatus and method for breaking up bubbles in a liquid flow'19995,799,994'Wafer handling tool with vacuum pickup'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–1999Patents assigned to TAIWAN SEMICONDUCTOR MFG (2)· patent assignee history
1998Based in Hwa Sung-Si, KR· patent location history
1999Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG21998–1999
Locations
LocationPatentsSpan
Hsinchu, TW11999
Hwa Sung-Si, KR11998