Inventor

Chia-Chung Wang

Inventor

Hsinchu, TW

Overview

1996–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 103 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%

H05KPrinted circuits20%

H10HInorganic light-emitting semiconductor devices having potential barriers17%

H01LSemiconductor devices14%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%

Y02PClimate change mitigation technologies in the production or processing of goods3%

F21KNon-electric light sources using luminescence2%

Y10TTechnical subjects covered by former us classification1%

C07CAcyclic or carbocyclic compounds0%

PatentTitleYear

10,804,205Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same2020 10,546,808Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly2020 10,446,526Face-to-face semiconductor assembly having semiconductor device in dielectric recess2019 10,420,204Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same2019 10,361,151Wiring board having isolator and bridging element and method of making wiring board2019 10,354,984Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same2019 10,306,777Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same2019 10,269,722Wiring board having component integrated with leadframe and method of making the same2019 10,242,964Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same2019 10,217,710Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same2019 10,211,067Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly2019 10,199,321Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same2019 10,177,090Package-on-package semiconductor assembly having bottom device confined by dielectric recess2019 10,177,130Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener2019 10,134,711Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same2018 10,121,768Thermally enhanced face-to-face semiconductor assembly with built-in heat spreader and method of making the same2018 10,096,573Face-to-face semiconductor assembly having semiconductor device in dielectric recess2018 10,062,663Semiconductor assembly with built-in stiffener and integrated dual routing circuitries and method of making the same2018 9,947,625Wiring board with embedded component and integrated stiffener and method of making the same2018 9,913,385'Methods of making stackable wiring board having electronic component in dielectric recess'2018 9,825,009'Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same'2017 9,640,518'Semiconductor package with package-on-package stacking capability and method of manufacturing the same'2017 9,570,372'Thermally enhanced semiconductor assembly with heat spreader and integrated dual build-up circuitries and method of making the same'2017 9,349,711'Semiconductor device with face-to-face chips on interposer and method of manufacturing the same'2016 9,318,411'Semiconductor package with package-on-package stacking capability and method of manufacturing the same'2016 9,299,651'Semiconductor assembly and method of manufacturing the same'2016 9,230,901'Semiconductor device having chip embedded in heat spreader and electrically connected to interposer and method of manufacturing the same'2016 9,209,154'Semiconductor package with package-on-package stacking capability and method of manufacturing the same'2015 9,147,587'Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same'2015 9,147,667'Semiconductor device with face-to-face chips on interposer and method of manufacturing the same'2015 9,087,847'Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same'2015 9,064,878'Wiring board with shielding lid and shielding slots as electromagnetic shields for embedded device'2015 9,018,667'Semiconductor chip assembly with post/base heat spreader and dual adhesives'2015 8,952,526'Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry'2015 8,927,339'Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry'2015 8,901,435'Hybrid wiring board with built-in stopper, interposer and build-up circuitry'2014 8,895,380'Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby'2014 8,865,525'Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby'2014 8,841,171'Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry'2014 8,614,502'Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device'2013 8,535,985'Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump'2013 8,531,024'Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace'2013 8,525,214'Semiconductor chip assembly with post/base heat spreader with thermal via'2013 8,415,703'Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange'2013 8,378,372'Semiconductor chip assembly with post/base heat spreader and horizontal signal routing'2013 8,354,688'Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump'2013 8,354,283'Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump'2013 8,343,808'Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry'2013 8,329,510'Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer'2012 8,324,653'Semiconductor chip assembly with ceramic/metal substrate'2012 8,324,723'Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump'2012 8,314,438'Semiconductor chip assembly with bump/base heat spreader and cavity in bump'2012 8,310,043'Semiconductor chip assembly with post/base heat spreader with ESD protection layer'2012 8,304,292'Method of making a semiconductor chip assembly with a ceramic/metal substrate'2012 8,298,868'Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole'2012 8,288,792'Semiconductor chip assembly with post/base/post heat spreader'2012 8,283,211'Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump'2012 8,269,336'Semiconductor chip assembly with post/base heat spreader and signal post'2012 8,241,962'Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity'2012 8,236,619'Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace'2012 8,236,618'Method of making a semiconductor chip assembly with a post/base/post heat spreader'2012 8,232,576'Semiconductor chip assembly with post/base heat spreader and ceramic block in post'2012 8,232,573'Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace'2012 8,227,270'Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal'2012 8,212,279'Semiconductor chip assembly with post/base heat spreader, signal post and cavity'2012 8,207,019'Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts'2012 8,207,553'Semiconductor chip assembly with base heat spreader and cavity in base'2012 8,203,167'Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal'2012 8,193,556'Semiconductor chip assembly with post/base heat spreader and cavity in post'2012 8,178,395'Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via'2012 8,163,603'Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding'2012 8,153,477'Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader'2012 8,148,747'Semiconductor chip assembly with post/base/cap heat spreader'2012 8,148,207'Method of making a semiconductor chip assembly with a post/base/cap heat spreader'2012 8,129,742'Semiconductor chip assembly with post/base heat spreader and plated through-hole'2012 8,110,446'Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace'2012 8,076,182'Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post'2011 8,067,270'Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate'2011 8,067,784'Semiconductor chip assembly with post/base heat spreader and substrate'2011 8,062,912'Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing'2011 8,034,645'Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader'2011 8,003,416'Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives'2011 8,003,415'Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing'2011 7,951,622'Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post'2011 7,948,076'Semiconductor chip assembly with post/base heat spreader and vertical signal routing'2011 7,939,375'Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post'2011 7,901,993'Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace'2011 7,811,863'Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment'2010 7,656,031'Stackable semiconductor package having metal pin within through hole of package'2010 7,494,843'Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding'2009 7,446,419'Semiconductor chip assembly with welded metal pillar of stacked metal balls'2008 7,419,851'Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal'2008 7,414,319'Semiconductor chip assembly with metal containment wall and solder terminal'2008 7,319,265'Semiconductor chip assembly with precision-formed metal pillar'2008 7,232,706'Method of making a semiconductor chip assembly with a precision-formed metal pillar'2007 7,232,707'Method of making a semiconductor chip assembly with an interlocked contact terminal'2007 7,075,186'Semiconductor chip assembly with interlocked contact terminal'2006 6,876,072'Semiconductor chip assembly with chip in substrate cavity'2005 6,872,591'Method of making a semiconductor chip assembly with a conductive trace and a substrate'2005 6,590,282'Stacked semiconductor package formed on a substrate and method for fabrication'2003 6,444,561'Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips'2002 6,218,726'Built-in stress pattern on IC dies and method of forming'2001 5,583,263'Process of making ketones'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996Based in Katy, TX, US· patent location history

2001–2003Patents assigned to IND TECH RES INST (3)· patent assignee history

2001–2015Based in Hsinchu, TW· patent location history

2002Based in Bode, TW· patent location history

2003Based in Bade City, TW· patent location history

2005–2020Patents assigned to BRIDGE SEMICONDUCTOR CORP (99)· patent assignee history

2011–2015Patents assigned to LIN CHARLES W C (47)· patent assignee history

2011–2015Patents assigned to WANG CHIA-CHUNG (45)· patent assignee history

2011–2015Patents assigned to LIM SANGWHOO (8)· patent assignee history

2015–2020Based in Hsinchu County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
BRIDGE SEMICONDUCTOR CORP	99	2005–2020
LIN CHARLES W C	47	2011–2015
WANG CHIA-CHUNGself	45	2011–2015
LIM SANGWHOO	8	2011–2015
IND TECH RES INST	3	2001–2003

Locations

Location	Patents	Span
Hsinchu, TW	71	2001–2015
Hsinchu County, TW	29	2015–2020
Bade City, TW	1	2003
Bode, TW	1	2002
Katy, Texas, US	1	1996