Inventor
Nan-Chin Chuang
Inventor
Taipei, TW
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H01QAntennas, i.e. radio aerials24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
G11CStatic stores3%
PatentTitleYear
11,043,731Package structure202111,004,810Semiconductor package structure202110,998,016Memory device including noise-suppressing mechanism202110,867,940Package structure and manufacturing method thereof202010,622,222Integrated fan-out package having multi-band antenna and method of forming the same202010,553,533Integrated fan-out package and manufacturing method thereof202010,510,693Semiconductor package structure201910,483,617Package structure201910,475,757Package structure and manufacturing method thereof201910,312,112Integrated fan-out package having multi-band antenna and method of forming the same201910,186,492Package structure and manufacturing method thereof2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (10)· patent assignee history
2019–2021Based in Taipei, TW· patent location history
2021Patents assigned to REALTEK SEMICONDUCTOR CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 10 | 2019–2021 |
| REALTEK SEMICONDUCTOR CORP | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 11 | 2019–2021 |