LexDanaLexDanabeta
Inventor

VALERY OUVAROV-BANCALERO

Inventor
US

Overview

2→
Patents
2024–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
C22CAlloys14%
H01FMagnets14%
H05KPrinted circuits14%
PatentTitleYear
12,230,564Package substrate z-disaggregation with liquid metal interconnects202512,183,688Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE2024

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024–2025Patents assigned to INTEL CORP (2)· patent assignee history
2024–2025Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP22024–2025
Locations
LocationPatentsSpan
US22024–2025