Inventor

Levi A. Campbell

Inventor

Poughkeepsie, NY, US

Overview

2005–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 258 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits32%

Y10TTechnical subjects covered by former us classification10%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%

F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact8%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application8%

G06FElectric digital data processing8%

F25BRefrigeration machines, plants or systems4%

B23PMetal-working not otherwise provided for4%

H01LSemiconductor devices2%

F24FAir-conditioning2%

PatentTitleYear

10,753,236Fuel vaporization using data center waste heat2020 10,734,307Composite heat sink structures2020 10,694,644Thermoelectric-enhanced, inlet air-cooled thermal conductors2020 10,662,961Pump with integrated bypass mechanism2020 10,595,447Effectiveness-weighted control of cooling system components2020 10,544,707Fuel vaporization using data center waste heat2020 10,385,878Solenoid actuated safety compliant fan finger guard structures and methods2019 10,309,423Mechanically actuated safety compliant fan finger guard structures and methods2019 10,299,409Protective louver assembly for air-moving assembly2019 10,287,925Fuel vaporization using data center waste heat2019 10,280,944Safety compliant fan finger guard integrated with anti-recirculation structure and method2019 10,265,812Liquid-cooled, composite heat sink assemblies2019 10,271,459Protective cover assembly for air-moving assembly2019 10,249,555Composite heat sink structures2019 10,244,665Effectiveness-weighted control of cooling system components2019 10,241,021Measurement of particulate matter deliquescence relative humidity2019 10,169,624Tamper-proof electronic packages with two-phase dielectric fluid2019 10,160,072Liquid-cooled, composite heat sink assemblies2018 10,082,048Fuel vaporization using data center waste heat2018 10,070,560Drawer-level immersion-cooling with hinged, liquid-cooled heat sink2018 10,024,606Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)2018 9,968,006Locking louver assembly for air-moving assembly2018 9,949,412Thermoelectric-enhanced, inlet air-cooled thermal conductors2018 9,907,211'Locking louver assembly for air-moving assembly'2018 9,904,811'Tamper-proof electronic packages with two-phase dielectric fluid'2018 9,865,522'Composite heat sink structures'2018 9,861,010'Protective louver assembly for air-moving assembly'2018 9,795,055'Electronics cooling assembly with multi-position, airflow-blocking mechanism'2017 9,763,357'Fabricating a liquid-cooling apparatus with coolant filter'2017 9,761,508'Composite heat sink structures'2017 9,750,159'Pump-enhanced, immersion-cooling of electronic compnent(s)'2017 9,687,943'Heat sink structure with a vapor-permeable membrane for two-phase cooling'2017 9,686,891'Thermoelectric-enhanced, inlet air cooling for an electronics rack'2017 9,686,889'Field-replaceable bank of immersion-cooled electronic components'2017 9,677,987'Measurement of particulate matter deliquescence relative humidity'2017 9,661,784'Multi-component electronic module with integral coolant-cooling'2017 9,648,786'Interlock assembly for air-moving assembly'2017 9,623,520'Heat sink structure with a vapor-permeable membrane for two-phase cooling'2017 9,629,286'Thermoelectric-enhanced, inlet air cooling for an electronics rack'2017 9,629,284'Interlock assembly for air-moving assembly'2017 9,622,379'Drawer-level immersion-cooling with hinged, liquid-cooled heat sink'2017 9,591,787'Selective clamping of electronics card to coolant-cooled structure'2017 9,546,576'Fuel vaporization using data center waste heat'2017 9,546,575'Fuel vaporization using data center waste heat'2017 9,504,188'Air-moving assembly with auxiliary turbine drive'2016 9,504,189'Thermoelectric-enhanced, inlet air-cooled thermal conductors'2016 9,497,888'Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s)'2016 9,470,439'Contaminant separator for a vapor-compression refrigeration apparatus'2016 9,474,186'Direct facility coolant cooling of a rack-mounted heat exchanger'2016 9,462,729'Tile assemblies faciliating failover airflow into cold air containment aisle'2016 9,456,527'Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly'2016 9,446,487'Heat sink structure with a vapor-permeable membrane for two-phase cooling'2016 9,439,325'Coolant-cooled heat sink configured for accelerating coolant flow'2016 9,420,721'Liquid-cooled heat sink assemblies'2016 9,414,525'Coolant-cooled heat sink configured for accelerating coolant flow'2016 9,414,519'Dehumidifying cooling apparatus and method for an electronics rack'2016 9,363,924'Ground-based heat sink facilitating electronic system cooling'2016 9,357,675'Pump-enhanced, immersion-cooling of electronic component(s)'2016 9,357,674'Liquid-cooling apparatus with integrated coolant filter'2016 9,357,682'Cooling method with automated seasonal freeze protection'2016 9,351,431'Cooling system with automated seasonal freeze protection'2016 9,345,169'Liquid-cooled heat sink assemblies'2016 9,341,418'Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)'2016 9,338,924'Dehumidifying cooling apparatus and method for an electronics rack'2016 9,332,674'Field-replaceable bank of immersion-cooled electronic components'2016 9,313,920'Direct coolant contact vapor condensing'2016 9,303,926'Condenser fin structures facilitating vapor condensation cooling of coolant'2016 9,298,231'Methods of fabricating a coolant-cooled electronic assembly'2016 9,301,433'Vapor-compression refrigeration apparatus with backup air-cooled heat sink and auxiliary refrigerant heater'2016 9,291,281'Thermostat-controlled coolant flow within a heat sink'2016 9,295,181'Coolant-conditioning unit with automated control of coolant flow valves'2016 9,285,050'Thermostat-controlled coolant flow within a heat sink'2016 9,288,932'Ground-based heat sink facilitating electronic system cooling'2016 9,282,678'Field-replaceable bank of immersion-cooled electronic components and separable heat sinks'2016 9,282,675'Thermal expansion-enhanced heat sink for an electronic assembly'2016 9,265,176'Multi-component electronic module with integral coolant-cooling'2016 9,265,177'Fabricating multi-component electronic module with integral coolant-cooling'2016 9,265,178'Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s)'2016 9,261,308'Pump-enhanced, sub-cooling of immersion-cooling fluid'2016 9,258,925'Selective clamping of electronics card to coolant-cooled structure'2016 9,250,024'Pump-enhanced, sub-cooling of immersion-cooling fluid'2016 9,253,923'Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s)'2016 9,253,921'Coolant-conditioning unit with automated control of coolant flow valves'2016 9,218,008'Effectiveness-weighted control of cooling system components'2015 9,213,343'Effectiveness-weighted control method for a cooling system'2015 9,207,002'Contaminant separator for a vapor-compression refrigeration apparatus'2015 9,210,830'Immersion-cooled and conduction-cooled method for electronic system'2015 9,210,831'Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly'2015 9,201,474'Valve controlled, node-level vapor condensation for two-phase heat sink(s)'2015 9,200,851'Pressure control unit and method facilitating single-phase heat transfer in a cooling system'2015 9,173,324'Dehumidifying cooling apparatus and method for an electronics rack'2015 9,167,721'Direct facility coolant cooling of a rack-mounted heat exchanger'2015 9,148,982'Separate control of coolant flow through coolant circuits'2015 9,148,983'Separate control of coolant flow through coolant circuits'2015 9,144,178'Selective clamping of electronics card to coolant-cooled structure'2015 9,113,581'Valve controlled, node-level vapor condensation for two-phase heat sink(s)'2015 9,102,021'Heat sink structure with a vapor-permeable membrane for two-phase cooling'2015 9,101,078'Data center cooling with an air-side economizer and liquid-cooled electronics rack(s)'2015 9,095,889'Thermoelectric-enhanced air and liquid cooling of an electronic system'2015 9,095,942'Wicking and coupling element(s) facilitating evaporative cooling of component(s)'2015 9,089,936'Heat sink structure with a vapor-permeable membrane for two-phase cooling'2015 9,078,379'Flow boiling heat sink with vapor venting and condensing'2015 9,075,582'Valve controlled, node-level vapor condensation for two-phase heat sink(s)'2015 9,069,532'Valve controlled, node-level vapor condensation for two-phase heat sink(s)'2015 9,067,288'Heat sink structure with a vapor-permeable membrane for two-phase cooling'2015 9,061,383'Heat sink structure with a vapor-permeable membrane for two-phase cooling'2015 9,061,382'Heat sink structure with a vapor-permeable membrane for two-phase cooling'2015 9,038,406'Dehumidifying cooling apparatus and method for an electronics rack'2015 9,042,099'Air-cooling and vapor-condensing door assembly'2015 9,042,098'Air-cooling and vapor-condensing door assembly'2015 9,025,331'Inlet-air-cooling door assembly for an electronics rack'2015 9,025,332'Inlet-air-cooling door assembly for an electronics rack'2015 9,013,872'Dry-cooling unit with gravity-assisted coolant flow'2015 9,009,968'Coolant manifold with separately rotatable manifold section(s)'2015 9,009,971'Wicking and coupling element(s) facilitating evaporative cooling of component(s)'2015 8,985,847'Thermal resistance-based monitoring of cooling of an electronic component'2015 8,966,922'Air-side economizer facilitating liquid-based cooling of an electronics rack'2015 8,964,390'Sectioned manifolds facilitating pumped immersion-cooling of electronic components'2015 8,964,391'Sectioned manifolds facilitating pumped immersion-cooling of electronic components'2015 8,959,941'Data center cooling with an air-side economizer and liquid-cooled electronics rack(s)'2015 8,955,347'Air-side economizer facilitating liquid-based cooling of an electronics rack'2015 8,955,346'Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load'2015 8,953,317'Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)'2015 8,953,320'Coolant drip facilitating partial immersion-cooling of electronic components'2015 8,947,873'Immersion-cooled and conduction-cooled electronic system'2015 8,941,994'Vapor condenser with three-dimensional folded structure'2015 8,934,250'Immersion-cooling of selected electronic component(s) mounted to printed circuit board'2015 8,925,333'Thermoelectric-enhanced air and liquid cooling of an electronic system'2015 8,929,080'Immersion-cooling of selected electronic component(s) mounted to printed circuit board'2015 8,922,998'Coolant manifold with separately rotatable manifold section(s)'2014 8,899,052'Thermoelectric-enhanced, refrigeration cooling of an electronic component'2014 8,879,257'Combined power and cooling rack supporting an electronics rack(s)'2014 8,867,209'Two-phase, water-based immersion-cooling apparatus with passive deionization'2014 8,857,057'Apparatus and method for facilitating servicing of a liquid-cooled electronics rack'2014 8,833,096'Heat exchange assembly with integrated heater'2014 8,824,143'Combined power and cooling rack supporting an electronics rack(S)'2014 8,817,465'Multi-rack assembly with shared cooling apparatus'2014 8,813,515'Thermoelectric-enhanced, vapor-compression refrigeration apparatus facilitating cooling of an electronic component'2014 8,817,474'Multi-rack assembly with shared cooling unit'2014 8,806,749'Two-phase, water-based immersion-cooling apparatus with passive deionization'2014 8,797,740'Multi-rack assembly method with shared cooling unit'2014 8,789,385'Thermoelectric-enhanced, vapor-compression refrigeration method facilitating cooling of an electronic component'2014 8,783,052'Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling'2014 8,760,863'Multi-rack assembly with shared cooling apparatus'2014 8,743,545'Thermal expansion-enhanced heat sink for an electronic assembly'2014 8,739,406'Vapor condenser with three-dimensional folded structure'2014 8,734,007'Calibrated airflow sensor facilitating monitoring of electronic system cooling'2014 8,720,063'Thermal expansion-enhanced heat sink for an electronic assembly'2014 8,713,957'Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s)'2014 8,713,955'Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus'2014 8,711,563'Dry-cooling unit with gravity-assisted coolant flow'2014 8,689,861'Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center'2014 8,619,425'Multi-fluid, two-phase immersion-cooling of electronic component(s)'2013 8,583,290'Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks'2013 8,564,952'Flow boiling heat sink structure with vapor venting and condensing'2013 8,550,702'Calibrated airflow sensor facilitating monitoring of electronic system cooling'2013 8,490,679'Condenser fin structures facilitating vapor condensation cooling of coolant'2013 8,472,182'Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack'2013 8,387,249'Apparatus and method for facilitating servicing of a liquid-cooled electronics rack'2013 8,369,091'Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack'2013 8,351,206'Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit'2013 8,345,423'Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems'2013 8,322,029'Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof'2012 8,322,154'Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system'2012 8,274,790'Automatically reconfigurable liquid-cooling apparatus for an electronics rack'2012 8,266,802'Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins'2012 8,248,801'Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat'2012 8,230,906'Dual-chamber fluid pump for a multi-fluid electronics cooling system and method'2012 8,208,258'System and method for facilitating parallel cooling of liquid-cooled electronics racks'2012 8,203,842'Open flow cold plate for immersion-cooled electronic packages'2012 8,194,406'Apparatus and method with forced coolant vapor movement for facilitating two-phase cooling of an electronic device'2012 8,189,334'Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack'2012 8,184,436'Liquid-cooled electronics rack with immersion-cooled electronic subsystems'2012 8,179,677'Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack'2012 8,144,467'Dehumidifying and re-humidifying apparatus and method for an electronics rack'2012 8,141,621'Apparatus and method for providing in situ cooling of computer data centers during service calls'2012 8,094,453'Compliant conduction rail assembly and method facilitating cooling of an electronics structure'2012 8,081,461'Cooling apparatus with thermally conductive porous material and jet impingement nozzle(s) extending therein'2011 8,059,405'Condenser block structures with cavities facilitating vapor condensation cooling of coolant'2011 8,051,897'Redundant assembly for a liquid and air cooled module'2011 8,027,162'Liquid-cooled electronics apparatus and methods of fabrication'2011 8,020,298'Method of fabricating a heat exchanger with angled secondary fins extending from primary fins'2011 8,018,720'Condenser structures with fin cavities facilitating vapor condensation cooling of coolant'2011 8,014,150'Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling'2011 7,990,709'Apparatus and method for facilitating cooling of an electronics rack'2011 7,983,040'Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem'2011 7,978,473'Cooling apparatus with cold plate formed in situ on a surface to be cooled'2011 7,978,472'Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof'2011 7,967,062'Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof'2011 7,963,119'Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center'2011 7,965,509'High performance dual-in-line memory (DIMM) array liquid cooling assembly and method'2011 7,961,475'Apparatus and method for facilitating immersion-cooling of an electronic subsystem'2011 7,956,458'Metal clad fiber optics for enhanced heat dissipation'2011 7,948,757'Multi-fluid cooling of an electronic device'2011 7,944,694'Liquid cooling apparatus and method for cooling blades of an electronic system chassis'2011 7,916,483'Open flow cold plate for liquid cooled electronic packages'2011 7,905,096'Dehumidifying and re-humidifying air cooling for an electronics rack'2011 7,907,406'System and method for standby mode cooling of a liquid-cooled electronics rack'2011 7,903,411'Cold plate stability'2011 7,883,266'Method and apparatus for defect detection in a cold plate'2011 7,885,074'Direct jet impingement-assisted thermosyphon cooling apparatus and method'2011 7,885,070'Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow'2011 7,878,007'Monitoring method and system for determining airflow rate through and heat removal rate of an air-conditioning unit'2011 7,841,385'Dual-chamber fluid pump for a multi-fluid electronics cooling system and method'2010 7,830,664'Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled'2010 7,788,941'Cooling system and method utilizing thermal capacitor unit(s) for enhanced thermal energy transfer efficiency'2010 7,787,248'Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof'2010 7,762,314'Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways'2010 7,751,918'Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates'2010 7,745,898'Multichip package, methods of manufacture thereof and articles comprising the same'2010 7,731,079'Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled'2010 7,724,524'Hybrid immersion cooled server with integral spot and bath cooling'2010 7,707,880'Monitoring method and system for determining rack airflow rate and rack power consumption'2010 7,709,296'Coupling metal clad fiber optics for enhanced heat dissipation'2010 7,665,325'Multi-fluid cooling system and method with freeze protection for cooling an electronic device'2010 7,660,121'System of facilitating cooling of electronics racks of a data center employing multiple cooling stations'2010 7,657,347'Temperature-based monitoring method and system for determining first and second fluid flow rates through a heat exchanger'2010 7,642,914'Auto-locating system and method for data center mapping and monitoring'2010 7,641,101'Method of assembling a cooling system for a multi-component electronics system'2010 7,639,499'Liquid cooling apparatus and method for facilitating cooling of an electronics system'2009 7,639,498'Conductive heat transport cooling system and method for a multi-component electronics system'2009 7,630,795'Method and air-cooling unit with dynamic airflow and heat removal adjustability'2009 7,609,519'Coolant control unit and cooled electronics system employing the same'2009 7,593,227'Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing'2009 7,518,871'Liquid-based cooling system for cooling a multi-component electronics system'2009 7,511,957'Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled'2009 7,508,676'Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability'2009 7,499,279'Cold plate stability'2009 7,492,593'Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow'2009 7,486,514'Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled'2009 7,486,512'Apparatus for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region'2009 7,477,514'Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations'2009 7,450,385'Liquid-based cooling apparatus for an electronics rack'2008 7,420,808'Liquid-based cooling system for cooling a multi-component electronics system'2008 7,408,776'Conductive heat transport cooling system and method for a multi-component electronics system'2008 7,405,936'Hybrid cooling system for a multi-component electronics system'2008 7,400,505'Hybrid cooling system and method for a multi-component electronics system'2008 7,400,504'Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled'2008 7,397,661'Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow'2008 7,385,817'Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled'2008 7,380,409'Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing'2008 7,375,962'Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus'2008 7,362,574'Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus'2008 7,349,209'Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region'2008 7,349,213'Coolant control unit, and cooled electronics system and method employing the same'2008 7,301,770'Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins'2007 7,298,617'Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled'2007 7,298,618'Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled'2007 7,286,351'Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system'2007 7,283,358'Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region'2007 7,277,283'Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold'2007 7,274,566'Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths'2007 7,272,005'Multi-element heat exchange assemblies and methods of fabrication for a cooling system'2007 7,233,494'Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins'2007 7,206,203'Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins'2007 7,184,269'Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly'2007 7,086,247'Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack'2006 6,973,801'Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2020Patents assigned to IBM (256)· patent assignee history

2005–2011Based in New Paltz, NY, US· patent location history

2008–2020Based in Poughkeepsie, NY, US· patent location history

2011–2015Patents assigned to CAMPBELL LEVI A (55)· patent assignee history

2011–2015Patents assigned to CHU RICHARD C (54)· patent assignee history

2011–2015Patents assigned to ELLSWORTH JR MICHAEL J (54)· patent assignee history

2011–2015Patents assigned to SIMONS ROBERT E (54)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	256	2005–2020
CAMPBELL LEVI Aself	55	2011–2015
CHU RICHARD C	54	2011–2015
ELLSWORTH JR MICHAEL J	54	2011–2015
SIMONS ROBERT E	54	2011–2015

Locations

Location	Patents	Span
Poughkeepsie, New York, US	239	2008–2020
New Paltz, New York, US	19	2005–2011