Inventor

Yasuhiko Onishi

Inventor
Nagano, JP

Overview

56→
Patents
1976–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 56 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices37%
H01LSemiconductor devices9%
H01BCables7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
Y10TTechnical subjects covered by former us classification6%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
B29CShaping or joining of plastics4%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds4%
B29LIndexing scheme associated with subclass b29c, relating to particular articles2%
C08LCompositions of macromolecular compounds2%
PatentTitleYear
9,954,078Method for manufacturing a semiconductor device having a super junction MOSFET20189,711,634'Semiconductor device including a super junction MOSFET'20179,577,087'Semiconductor apparatus'20179,437,727'Semiconductor element including active region, low resistance layer and vertical drift portion'20169,339,549'Cationic graft-copolymer for drug delivery system'20169,219,141'Super junction MOSFET, method of manufacturing the same, and complex semiconductor device'20159,142,664'Semiconductor device'20159,123,561'Superjunction semiconductor device'20159,087,893'Superjunction semiconductor device with reduced switching loss'20158,957,502'Semiconductor device'20158,786,015'Super-junction semiconductor device'20148,748,982'High breakdown voltage semiconductor device'20148,742,500'Semiconductor device'20148,735,982'Semiconductor device with superjunction structure'20148,432,013'Semiconductor device and a method of manufacturing the same'20137,911,020'Semiconductor device having breakdown voltage maintaining structure and its manufacturing method'20117,473,733'Cationic graft-copolymer for non-viral gene delivery vector'20097,372,111'Semiconductor device with improved breakdown voltage and high current capacity'20087,235,841'Semiconductor device'20077,042,046'Super-junction semiconductor device and method of manufacturing the same'20067,002,211'Lateral super-junction semiconductor device'20067,002,205'Super-junction semiconductor device and method of manufacturing the same'20066,903,418'Semiconductor device'20056,900,109'Method of manufacturing a semiconductor device with a vertical drain drift layer of the alternating-conductivity-type'20056,825,537'Vertical field effect transistor'20046,825,565'Semiconductor device'20046,768,167'MIS semiconductor device and the manufacturing method thereof'20046,756,636'Lateral super-junction semiconductor device'20046,724,042'Super-junction semiconductor device'20046,700,141'Semiconductor device'20046,696,728'Super-junction semiconductor device'20046,693,323'Super-junction semiconductor device'20046,677,643'Super-junction semiconductor device'20046,674,126'Semiconductor device'20046,621,132'Semiconductor device'20036,611,021'Semiconductor device and the method of manufacturing the same'20036,586,801'Semiconductor device having breakdown voltage limiter regions'20036,576,935'Bidirectional semiconductor device and method of manufacturing the same'20036,475,864'Method of manufacturing a super-junction semiconductor device with an conductivity type layer'20026,133,661'Rotating electric machine usable in radioactive environment'20005,998,027'Heat-resistant, benzimidazol polymer coated flat electrical wire'19995,894,139'Semiconductor device structure for insulated gate bipolar transistor'19995,834,117'Heat-resistant electrical wire comprising a benzimidazole-based polymer coating'19985,725,953'Heat-proof electric wire having a benzimidazole-based polymer coating'19985,674,614'Varnish-coated electric wire and method of producing the same'19975,614,144'Method of manufacturing three-dimensional compact'19975,575,969'Method of attaching clip to blow molded article and the clip'19965,549,946'Varnish-coated heat-resistant roll for copying machine, and method of producing the same'19965,500,179'Method of manufacturing harness part for automobile'19965,370,808'Filling grease composition for automobile wire harness connector'19945,309,625'Card type fuse and method of producing the same'19945,133,910'Device and method of evaluating molded piece for injection molding machine'19925,039,727'Polybutylene terephthalate moulding compositions with an improved flowability'19914,816,540'Cationic graft-copolymer'19894,808,709'Matrix polymer and its preparation'19893,989,656'Dextran-alkyl methacrylate graft composition for contact lens and corneas'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–2017Patents assigned to ONISHI YASUHIKO (10)· patent assignee history
1989Based in Toyota-shi, Aichi-ken, JP· patent location history
1991–2000Patents assigned to SUMITOMO WIRING SYSTEMS (13)· patent assignee history
1991–2016Based in Seto, JP· patent location history
1994–1999Based in Yokkaichi, JP· patent location history
1999–2018Patents assigned to FUJI ELECTRIC CO LTD (29)· patent assignee history
1999–2015Based in Nagano, JP· patent location history
2004–2008Patents assigned to FUJI ELEC DEVICE TECH CO LTD (6)· patent assignee history
2013–2018Based in Matsumoto, JP· patent location history
2015–2017Patents assigned to SUGI AKIO (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJI ELECTRIC CO LTD291999–2018
SUMITOMO WIRING SYSTEMS131991–2000
ONISHI YASUHIKOself101989–2017
FUJI ELEC DEVICE TECH CO LTD62004–2008
SUGI AKIO22015–2017
Locations
LocationPatentsSpan
Nagano, JP251999–2015
Matsumoto, JP132013–2018
Yokkaichi, JP91994–1999
Seto, JP41991–2016
Toyota-shi, Aichi-ken, JP21989