Inventor
Sheng-Hsiang Chiu
Inventor
Tainan, TW
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
B23KSoldering or unsoldering4%
H04NPictorial communication, e.g. television4%
H05KPrinted circuits4%
PatentTitleYear
10,797,025Advanced INFO POP and method of forming thereof202010,757,310Miniature image pickup module and manufacturing method thereof202010,741,508Semiconductor device having antenna and manufacturing method thereof202010,325,883Package-on-package structure and method201910,283,470Semiconductor package and manufacturing method thereof201910,283,377Integrated fan-out package and manufacturing method thereof201910,163,754Lid design for heat dissipation enhancement of die package20189,859,229'Package structure and method for forming the same'20189,818,729'Package-on-package structure and method'20178,048,778'Methods of dicing a semiconductor structure'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011Patents assigned to TAIWAN SEMICONDUCTOR MFG (1)· patent assignee history
2011–2020Based in Tainan, TW· patent location history
2017–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (8)· patent assignee history
2020Patents assigned to PRIMAX ELECTRONICS LTD (1)· patent assignee history
2020Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 8 | 2017–2020 |
| PRIMAX ELECTRONICS LTD | 1 | 2020 |
| TAIWAN SEMICONDUCTOR MFG | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tainan, TW | 9 | 2011–2020 |
| Taipei, TW | 1 | 2020 |