LexDanaLexDanabeta
Inventor

YAO-TSUNG HUANG

Inventor
TW

Overview

3→
Patents
2022–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10DInorganic electric semiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
PatentTitleYear
12,581,971Semiconductor device with bridge die electrically connecting two chips and manufacturing method thereof202612,237,401Semiconductor chip202511,450,756Manufacturing method of semiconductor chip2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2026Patents assigned to MEDIATEK INC (3)· patent assignee history
2022–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MEDIATEK INC32022–2026
Locations
LocationPatentsSpan
TW32022–2026