Inventor

Shoichi Osada

Inventor

Annaka, JP

Overview

1997–2021

Patent span

Chemistry

Primary field (CPC C)

Patents· 27 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%

C08LCompositions of macromolecular compounds19%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds16%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients14%

Y10TTechnical subjects covered by former us classification11%

H01LSemiconductor devices4%

C09DCoating compositions, e.g. paints, varnishes or lacquers3%

C01GCompounds containing metals not covered by subclasses c01d or c01f2%

C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds2%

C04BLime, magnesia2%

PatentTitleYear

11,028,269Silicone-modified epoxy resin composition and semiconductor device2021 10,851,261Semiconductor-encapsulating epoxy resin composition and semiconductor device2020 10,676,635Silicone-modified epoxy resin composition and semiconductor device2020 9,633,921'Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin composition'2017 8,796,375'Prepreg, metal-clad laminate, printed wiring board, and semiconductor device'2014 8,048,969'Semiconductor encapsulating epoxy resin composition and semiconductor device'2011 8,022,137'Silicone resin composition for optical semiconductor devices'2011 7,999,016'Semiconductor encapsulating epoxy resin composition and semiconductor device'2011 7,969,027'Semiconductor device encapsulated with resin composition'2011 7,910,638'Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device'2011 7,898,094'Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith'2011 7,511,383'Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices'2009 7,122,587'Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device'2006 7,095,125'Semiconductor encapsulating epoxy resin composition and semiconductor device'2006 6,894,091'Semiconductor encapsulating epoxy resin composition and semiconductor device'2005 6,783,859'Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device'2004 6,630,745'Semiconductor encapsulating epoxy resin composition and semiconductor device'2003 6,518,332'Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith'2003 6,297,306'Semiconductor encapsulating epoxy resin composition and semiconductor device'2001 6,291,556'Semiconductor encapsulating epoxy resin composition and semiconductor device'2001 6,274,251'Semiconductor encapsulating epoxy resin composition and semiconductor device'2001 6,221,509'Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith'2001 6,168,872'Semiconductor encapsulating epoxy resin composition and semiconductor device'2001 6,162,878'Semiconductor encapsulating epoxy resin composition and semiconductor device'2000 6,160,078'Semiconductor encapsulating epoxy resin composition and semiconductor device'2000 6,017,497'Atomizing roasting furnace for producing ferrite raw material powder'2000 5,688,430'Soft ferrite raw material powder, its sintered body, and their production method and apparatus'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2000Patents assigned to NIPPON STEEL CORP (2)· patent assignee history

1997–2000Based in Tokyo, JP· patent location history

2000–2021Patents assigned to SHINETSU CHEMICAL CO (24)· patent assignee history

2000–2011Based in Gunma, JP· patent location history

2000–2006Based in Usui-gun, JP· patent location history

2001Patents assigned to HOKKO CHEM IND CO (2)· patent assignee history

2001Patents assigned to SHIN-ETSU CHEMICAL CO (1)· patent assignee history

2001Patents assigned to TATSUMORI LTD (1)· patent assignee history

2009–2021Based in Annaka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SHINETSU CHEMICAL CO	24	2000–2021
HOKKO CHEM IND CO	2	2001
NIPPON STEEL CORP	2	1997–2000
SHIN-ETSU CHEMICAL CO	1	2001
TATSUMORI LTD	1	2001

Locations

Location	Patents	Span
Annaka, JP	11	2009–2021
Gunma, JP	9	2000–2011
Usui-gun, JP	5	2000–2006
Tokyo, JP	2	1997–2000