Inventor
Chau Fatt Chiang
Inventor
Melaka, MY
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H01LSemiconductor devices20%
B81BMicrostructural devices or systems, e.g. micromechanical devices10%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers5%
B29CShaping or joining of plastics3%
B29LIndexing scheme associated with subclass b29c, relating to particular articles3%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts2%
C09DCoating compositions, e.g. paints, varnishes or lacquers2%
PatentTitleYear
10,796,981Chip to lead interconnect in encapsulant of molded semiconductor package202010,777,536Semiconductor package with air cavity202010,639,833Molding system with movable mold tool202010,631,100Micro-electrical mechanical system sensor package and method of manufacture thereof202010,595,132Micro-electrical mechanical system sensor package and method of manufacture thereof202010,549,985Semiconductor package with a through port for sensor applications202010,501,312Over-under sensor packaging with sensor spaced apart from control chip201910,490,470Semiconductor package and method for fabricating a semiconductor package201910,396,018Multi-phase half bridge driver package and methods of manufacture201910,396,007Semiconductor package with plateable encapsulant and a method for manufacturing the same201910,304,780Device having substrate with conductive pillars201910,163,812Device having substrate with conductive pillars201810,099,411Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips20189,868,632'Molded cavity package with embedded conductive layer and enhanced sealing'20189,475,691'Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device'20168,053,280'Method of producing multiple semiconductor devices'20117,977,161'Method of manufacturing a semiconductor package using a carrier'20117,838,332'Method of manufacturing a semiconductor package with a bump using a carrier'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2020Patents assigned to INFINEON TECHNOLOGIES AG (17)· patent assignee history
2010–2020Based in Melaka, MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 17 | 2010–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Melaka, MY | 18 | 2010–2020 |