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Inventor

Thiam Chye Lim

Inventor
Singapore, SG

Overview

18→
Patents
2004–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H10DInorganic electric semiconductor devices32%
H01LSemiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
A61FFilters implantable into blood vessels3%
A61LMethods or apparatus for sterilising materials or objects in general3%
A61MDevices for introducing media into, or onto, the body3%
C08LCompositions of macromolecular compounds3%
PatentTitleYear
10,115,715Methods of making semiconductor device packages and related semiconductor device packages20189,673,183'Methods of making semiconductor device packages and related semiconductor device packages'20179,492,279'Bioabsorbable plug implants and method for bone tissue regeneration'20168,373,277'Stacked die in die BGA package'20137,799,610'Method of fabricating a stacked die having a recess in a die BGA package'20107,575,953'Stacked die with a recess in a die BGA package'20097,371,608'Method of fabricating a stacked die having a recess in a die BGA package'20087,358,117'Stacked die in die BGA package'20087,344,969'Stacked die in die BGA package'20087,332,820'Stacked die in die BGA package'20087,332,819'Stacked die in die BGA package'20087,309,623'Method of fabricating a stacked die in die BGA package'20077,282,392'Method of fabricating a stacked die in die BGA package'20077,282,390'Stacked die-in-die BGA package with die having a recess'20077,259,451'Invertible microfeature device packages'20077,112,048'BOC BGA package for die with I-shaped bond pad layout'20066,720,666'BOC BGA package for die with I-shaped bond pad layout'20046,692,987'BOC BGA package for die with I-shaped bond pad layout'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2018Patents assigned to MICRON TECHNOLOGY INC (17)· patent assignee history
2004–2018Based in Singapore, SG· patent location history
2013Patents assigned to CHEW BENG CHYE (1)· patent assignee history
2013Patents assigned to LIM THIAM CHYE (1)· patent assignee history
2013Patents assigned to NEO CHEE PENG (1)· patent assignee history
2016Patents assigned to OSTEOPORE INT PTE LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC172004–2018
CHEW BENG CHYE12013
LIM THIAM CHYEself12013
NEO CHEE PENG12013
OSTEOPORE INT PTE LTD12016
Locations
LocationPatentsSpan
Singapore, SG182004–2018