Inventor
I HSUAN WEI
Inventor
TW
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10DInorganic electric semiconductor devices25%
H10NElectric solid-state devices not otherwise provided for25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
12,568,819Semiconductor structure2026Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2026Patents assigned to POWERCHIP SEMICONDUCTOR MFG CORP (1)· patent assignee history
2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| POWERCHIP SEMICONDUCTOR MFG CORP | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 1 | 2026 |