Inventor
JUWEN GAO
Inventor
US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
C23CCoating metallic material18%
H10BElectronic memory devices18%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
12,444,651Tungsten feature fill with nucleation inhibition202512,060,639Rapid flush purging during atomic layer deposition202412,014,928Multi-layer feature fill202411,972,952Atomic layer deposition on 3D NAND structures202411,901,227Feature fill with nucleation inhibition202411,670,516Metal-containing passivation for high aspect ratio etch202311,410,883Tungsten feature fill with nucleation inhibition202211,348,795Metal fill process for three-dimensional vertical NAND wordline2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to LAM RES CORP (6)· patent assignee history
2022–2025Patents assigned to NOVELLUS SYSTEMS INC (2)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 6 | 2022–2024 |
| NOVELLUS SYSTEMS INC | 2 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 8 | 2022–2025 |