Inventor

Masahiro Tamaki

Inventor

Tokyo, JP

Overview

1995–2003

Patent span

Electricity

Primary field (CPC H)

Patents· 24 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary

B29CShaping or joining of plastics27%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%

C25DProcesses for the electrolytic or electrophoretic production of coatings10%

H10DInorganic electric semiconductor devices5%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%

F15BSystems acting by means of fluids in general2%

F16HGearing2%

G01NInvestigating or analysing materials by determining their chemical or physical properties2%

PatentTitleYear

6,589,815'Method of manufacturing semiconductor device with plated heat sink by laser cutting'2003 6,537,057'Mold clamping apparatus for injection molding machine'2003 6,533,573'Mold clamping apparatus for injection molding machine'2003 6,500,325'Method of plating semiconductor wafer and plated semiconductor wafer'2002 6,391,770'Method of manufacturing semiconductor device'2002 6,332,355'Method of estimating a life of ball screw included in electric injection molding machine and life estimating system'2001 6,329,671'Semiconductor device and method of manufacturing the same'2001 6,325,954'Method of controlling electric injection unit of injection molding machine'2001 6,309,203'Injection apparatus for injection molding machine'2001 6,270,333'Mold clamping apparatus for injection molding machine'2001 6,268,619'Semiconductor device with high aspect ratio via hole including solder repelling coating'2001 6,245,596'Method of producing semiconductor device with heat dissipation metal layer and metal projections'2001 6,210,554'Method of plating semiconductor wafer and plated semiconductor wafer'2001 6,157,077'Semiconductor device with plated heat sink and partially plated side surfaces'2000 6,144,182'Motor control method for injection molding machine and motor controller for carrying out the same'2000 6,136,668'Method of dicing semiconductor wafer'2000 6,132,198'Clamping apparatus for injection molding machine'2000 6,109,036'Sealed hydraulic intensifier'2000 6,059,556'Injection apparatus for injection molding machine'2000 6,050,804'Clamping apparatus for injection molding machine'2000 6,033,540'Plating apparatus for plating a wafer'2000 6,008,537'Semiconductor device with heat dissipation metal layer and metal projections'1999 5,853,559'Apparatus for electroplating a semiconductor substrate'1998 5,457,072'Process for dicing a semiconductor wafer having a plated heat sink using a temporary substrate'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2003Patents assigned to MITSUBISHI ELECTRIC CORP (13)· patent assignee history

1995Based in Itami, JP· patent location history

1998–2003Based in Tokyo, JP· patent location history

2000–2003Patents assigned to TOSHIBA MACHINE CO LTD (11)· patent assignee history

2000–2003Based in Shizuoka, JP· patent location history

2000–2001Based in Susono, JP· patent location history

2000–2001Based in Hyogo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MITSUBISHI ELECTRIC CORP	13	1995–2003
TOSHIBA MACHINE CO LTD	11	2000–2003

Locations

Location	Patents	Span
Tokyo, JP	10	1998–2003
Shizuoka, JP	6	2000–2003
Susono, JP	5	2000–2001
Hyogo, JP	2	2000–2001
Itami, JP	1	1995