Inventor
Ka Shing Kenny Kwan
Inventor
Singapore, SG
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
B23KSoldering or unsoldering29%
Y10TTechnical subjects covered by former us classification8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, e.g. for performing mechanical work in general4%
H01LSemiconductor devices4%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding1%
B41FPrinting machines or presses1%
B41PIndexing scheme relating to printing, lining machines, typewriters, and to stamps1%
PatentTitleYear
9,640,512'Wire bonding apparatus comprising an oscillator mechanism'20179,254,641'Screen printer, and method of cleaning a stencil of a screen printer'20169,070,762'Lead frame support plate and window clamp for wire bonding machines'20158,919,631'Wire bonder including a transducer, a bond head, and a mounting apparatus'20148,752,751'Lead frame support plate and window clamp for wire bonding machines'20148,707,550'Bonding machine incorporating dual-track transfer mechanism'20148,256,658'Wire bonding apparatus comprising rotary positioning stage'20128,186,562'Apparatus for increasing coverage of shielding gas during wire bonding'20127,997,470'Flanged transducer having improved rigidity'20117,954,689'Vacuum wire tensioner for wire bonder'20117,766,211'Temperature control of a bonding stage'20107,681,775'Multi-layer thermal insulation for a bonding system'20107,677,431'Electronic device handler for a bonding apparatus'20107,628,307'Apparatus for delivering shielding gas during wire bonding'20097,614,540'Thermal insulation for a bonding tool'20097,568,606'Electronic device handler for a bonding apparatus'20097,549,569'Wire clamp gap control mechanism and method'20097,532,428'Soft touch clamp actuation mechanism'20097,306,082'Passive damping of vibrations in a support structure'20077,303,110'Flange-mounted transducer'20077,303,109'Stud bumping apparatus'20077,240,820'Clamping device for processing electronic devices'20077,182,793'System for reducing oxidation of electronic devices'20077,103,959'Conduit for preventing oxidation of a electronic device'20067,100,812'Capillary holder'20067,025,243'Bondhead for wire bonding apparatus'20066,948,387'Clamp calibration apparatus and method'20056,918,528'Transducer tool holder'20056,866,182'Apparatus and method to prevent oxidation of electronic devices'20056,861,771'Active vibration attenuation'20056,749,100'Multiple-head wire-bonding system'20046,644,533'Force sensing apparatus'20036,425,514'Force sensing apparatus'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2017Patents assigned to ASM TECH SINGAPORE PTE LTD (32)· patent assignee history
2002–2017Based in Singapore, SG· patent location history
2012–2014Patents assigned to KWAN KA SHING KENNY (3)· patent assignee history
2012–2014Patents assigned to SONG KENG YEW JAMES (2)· patent assignee history
2014Patents assigned to He ting yu (2)· patent assignee history
2014Patents assigned to KWAN KA SHING (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ASM TECH SINGAPORE PTE LTD | 32 | 2002–2017 |
| KWAN KA SHING KENNYself | 3 | 2012–2014 |
| He ting yu | 2 | 2014 |
| KWAN KA SHINGself | 2 | 2014 |
| SONG KENG YEW JAMES | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 33 | 2002–2017 |