Inventor
YUKITERU MATSUI
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing29%
H01LSemiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
C09GPolishing compositions14%
C08LCompositions of macromolecular compounds7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
PatentTitleYear
12,300,499Polishing solution, polishing apparatus, and polishing method202511,986,920Polishing method, polishing agent and cleaning agent for polishing202411,883,926Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device202411,534,886Polishing device, polishing head, polishing method, and method of manufacturing semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to KIOXIA CORP (4)· patent assignee history
2022–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KIOXIA CORP | 4 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2022–2025 |