Inventor
Manoocher Birang
Inventor
Los Gatos, CA, US
Overview
Patents· 162 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing32%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
G01BMeasuring length, thickness or similar linear dimensions13%
B24DTools for grinding, buffing or sharpening8%
Y10TTechnical subjects covered by former us classification5%
H02NElectric machines not otherwise provided for3%
C23CCoating metallic material2%
B41JTypewriters2%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
H10KOrganic electric solid-state devices2%
PatentTitleYear
10,105,811Eddy current system having an elongated core for in-situ profile measurement201810,029,497Apparatus and method for control of print gap20189,789,715'Apparatus and method for control of print gap'20179,656,491'Apparatus and method for control of print gap'20179,550,383'Apparatus and method for control of print gap'20179,333,621'Polishing pad for endpoint detection and related methods'20169,302,513'Apparatus and method for control of print gap'20169,120,344'Apparatus and method for control of print gap'20158,858,298'Polishing pad with two-section window having recess'20148,795,029'Apparatus and method for in-situ endpoint detection for semiconductor processing operations'20148,758,086'Friction sensor for polishing system'20148,556,679'Substrate polishing metrology using interference signals'20138,506,356'Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations'20138,485,862'Polishing pad for endpoint detection and related methods'20138,460,057'Computer-implemented process control in chemical mechanical polishing'20138,342,906'Friction sensor for polishing system'20138,216,441'Electrophoretic solar cell metallization process and apparatus'20128,092,274'Substrate polishing metrology using interference signals'20127,999,540'Eddy current apparatus and method for in-situ profile measurement'20117,971,489'Carbon nanotube-based load cells'20117,947,131'Copper deposition chamber having integrated bevel clean with edge bevel removal detection'20117,935,240'Electroplating apparatus and method based on an array of anodes'20117,927,182'Polishing system with in-line and in-situ metrology'20117,841,926'Substrate polishing metrology using interference signals'20107,837,851'In-situ profile measurement in an electroplating process'20107,775,852'Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations'20107,731,566'Substrate polishing metrology using interference signals'20107,727,364'Auxiliary electrode encased in cation exchange membrane tube for electroplating cell'20107,682,221'Integrated endpoint detection system with optical and eddy current monitoring'20107,591,708'Method and apparatus of eddy current monitoring for chemical mechanical polishing'20097,585,202'Computer-implemented method for process control in chemical mechanical polishing'20097,534,298'Apparatus and method of detecting the electroless deposition endpoint'20097,513,818'Polishing endpoint detection system and method using friction sensor'20097,500,901'Data processing for monitoring chemical mechanical polishing'20097,429,207'System for endpoint detection with polishing pad'20087,400,934'Methods and apparatus for polishing control'20087,374,477'Polishing pads useful for endpoint detection in chemical mechanical polishing'20087,354,334'Reducing polishing pad deformation'20087,344,432'Conductive pad with ion exchange membrane for electrochemical mechanical polishing'20087,311,592'Conductive polishing article for electrochemical mechanical polishing'20077,303,467'Chemical mechanical polishing apparatus with rotating belt'20077,294,039'Polishing system with in-line and in-situ metrology'20077,255,629'Polishing assembly with a window'20077,229,340'Monitoring a metal layer during chemical mechanical polishing'20077,226,514'Spin-rinse-dryer'20077,195,536'Integrated endpoint detection system with optical and eddy current monitoring'20077,153,185'Substrate edge detection'20067,137,879'Conductive polishing article for electrochemical mechanical polishing'20067,118,457'Method of forming a polishing pad for endpoint detection'20067,118,450'Polishing pad with window and method of fabricating a window in a polishing pad'20067,112,960'Eddy current system for in-situ profile measurement'20067,104,875'Chemical mechanical polishing apparatus with rotating belt'20067,101,251'Polishing system with in-line and in-situ metrology'20067,101,254'System and method for in-line metal profile measurement'20067,097,537'Determination of position of sensor measurements during polishing'20067,074,109'Chemical mechanical polishing control system and method'20067,066,800'Conductive polishing article for electrochemical mechanical polishing'20067,040,971'Carrier head with a flexible membrane'20067,018,275'Closed-loop control of wafer polishing in a chemical mechanical polishing system'20067,014,538'Article for polishing semiconductor substrates'20067,016,795'Signal improvement in eddy current sensing'20067,011,565'Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus'20067,008,295'Substrate monitoring during chemical mechanical polishing'20067,008,297'Combined eddy current sensing and optical monitoring for chemical mechanical polishing'20067,008,875'Methods and apparatus for polishing control'20067,008,296'Data processing for monitoring chemical mechanical polishing'20067,001,246'Method and apparatus for monitoring a metal layer during chemical mechanical polishing'20067,001,242'Method and apparatus of eddy current monitoring for chemical mechanical polishing'20066,991,517'Linear polishing sheet with window'20066,991,516'Chemical mechanical polishing with multi-stage monitoring of metal clearing'20066,988,942'Conductive polishing article for electrochemical mechanical polishing'20066,986,699'Method and apparatus for determining polishing endpoint with multiple light sources'20066,977,036'Method and apparatus for substrate polishing'20056,975,107'Eddy current sensing of metal removal for chemical mechanical polishing'20056,966,816'Integrated endpoint detection system with optical and eddy current monitoring'20056,939,198'Polishing system with in-line and in-situ metrology'20056,930,478'Method for monitoring a metal layer during chemical mechanical polishing using a phase difference signal'20056,924,641'Method and apparatus for monitoring a metal layer during chemical mechanical polishing'20056,910,944'Method of forming a transparent window in a polishing pad'20056,887,129'Chemical mechanical polishing with friction-based control'20056,878,038'Combined eddy current sensing and optical monitoring for chemical mechanical polishing'20056,878,036'Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal'20056,875,078'Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations'20056,876,454'Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations'20056,860,791'Polishing pad for in-situ endpoint detection'20056,857,946'Carrier head with a flexure'20056,841,057'Method and apparatus for substrate polishing'20056,832,948'Thermal preconditioning fixed abrasive articles'20046,811,466'System and method for in-line metal profile measurement'20046,796,880'Linear polishing sheet with window'20046,776,692'Closed-loop control of wafer polishing in a chemical mechanical polishing system'20046,729,944'Chemical mechanical polishing apparatus with rotating belt'20046,719,818'Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations'20046,676,717'Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations'20046,659,842'Method and apparatus for optical monitoring in chemical mechanical polishing'20036,659,849'Platen with debris control for chemical mechanical planarization'20036,632,124'Optical monitoring in a two-step chemical mechanical polishing process'20036,623,334'Chemical mechanical polishing with friction-based control'20036,592,439'Platen for retaining polishing material'20036,585,563'In-situ monitoring of linear substrate polishing operations'20036,572,446'Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane'20036,557,564'Method and apparatus for cleaning a thin disk'20036,557,248'Method of fabricating an electrostatic chuck'20036,554,003'Method and apparatus for cleaning a thin disc'20036,540,594'Carrier head with a flexible membrane for a chemical mechanical polishing system'20036,540,595'Chemical-Mechanical polishing apparatus and method utilizing an advanceable polishing sheet'20036,537,133'Method for in-situ endpoint detection for chemical mechanical polishing operations'20036,520,841'Apparatus and methods for chemical mechanical polishing with an incrementally advanceable polishing sheet'20036,516,816'Spin-rinse-dryer'20036,514,124'Carrier head for chemical mechanical polishing a substrate'20036,511,367'Carrier head with local pressure control for a chemical mechanical polishing apparatus'20036,506,097'Optical monitoring in a two-step chemical mechanical polishing process'20036,485,359'Platen arrangement for a chemical-mechanical planarization apparatus'20026,474,712'Gripper for supporting substrate in a vertical orientation'20026,447,374'Chemical mechanical planarization system'20026,412,503'Magnetically coupled substrate roller'20026,413,873'System for chemical mechanical planarization'20026,406,359'Apparatus for transferring semiconductor substrates using an input module'20026,399,501'Method and apparatus for detecting polishing endpoint with optical monitoring'20026,390,904'Retainers and non-abrasive liners used in chemical mechanical polishing'20026,390,908'Determining when to replace a retaining ring used in substrate polishing operations'20026,386,955'Carrier head with a flexible membrane for a chemical mechanical polishing system'20026,383,058'Adaptive endpoint detection for chemical mechanical polishing'20026,381,021'Method and apparatus for measuring reflectivity of deposited films'20026,379,231'Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet'20026,368,191'Carrier head with local pressure control for a chemical mechanical polishing apparatus'20026,348,124'Delivery of polishing agents in a wafer processing system'20026,296,548'Method and apparatus for optical monitoring in chemical mechanical polishing'20016,280,290'Method of forming a transparent window in a polishing pad'20016,247,998'Method and apparatus for determining substrate layer thickness during chemical mechanical polishing'20016,244,935'Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet'20016,183,354'Carrier head with a flexible membrane for a chemical mechanical polishing system'20016,179,709'In-situ monitoring of linear substrate polishing operations'20016,159,079'Carrier head for chemical mechanical polishing a substrate'20006,159,087'End effector for pad conditioning'20006,146,259'Carrier head with local pressure control for a chemical mechanical polishing apparatus'20006,045,439'Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus'20006,023,405'Electrostatic chuck with improved erosion resistance'20005,989,103'Magnetic carrier head for chemical mechanical polishing'19995,974,679'Measuring the profile of a polishing pad in a chemical mechanical polishing system'19995,964,643'Apparatus and method for in-situ monitoring of chemical mechanical polishing operations'19995,938,507'Linear conditioner apparatus for a chemical mechanical polishing system'19995,893,796'Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus'19995,883,778'Electrostatic chuck with fluid flow regulator'19995,875,559'Apparatus for measuring the profile of a polishing pad in a chemical mechanical polishing system'19995,846,882'Endpoint detector for a chemical mechanical polishing system'19985,822,171'Electrostatic chuck with improved erosion resistance'19985,753,132'Method of making electrostatic chuck with conformal insulator film'19985,745,331'Electrostatic chuck with conformal insulator film'19985,743,784'Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process'19985,708,506'Apparatus and method for detecting surface roughness in a chemical polishing pad conditioning process'19985,671,117'Electrostatic chuck'19975,646,814'Multi-electrode electrostatic chuck'19975,634,266'Method of making a dielectric chuck'19975,612,850'Releasing a workpiece from an electrostatic chuck'19975,491,603'Method of determining a dechucking voltage which nullifies a residual electrostatic force between an electrostatic chuck and a wafer'19965,459,632'Releasing a workpiece from an electrostatic chuck'19955,343,412'Method and apparatus for displaying process endpoint signal based on emission concentration within a processing chamber'19945,151,584'Method and apparatus for endpoint detection in a semiconductor wafer etching system'19925,097,430'Method and apparatus for displaying process end point signal based on emission concentration within a processing chamber'19925,077,464'Method and apparatus for endpoint detection in a semiconductor wafer etching system'19914,953,982'Method and apparatus for endpoint detection in a semiconductor wafer etching system'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2018Patents assigned to APPLIED MATERIALS INC (156)· patent assignee history
1990–1992Based in Santa Clara, CA, US· patent location history
1992–2018Based in Los Gatos, CA, US· patent location history
2002Based in Mountain View, CA, US· patent location history
2002Based in Sarasota, FL, US· patent location history
2012–2018Patents assigned to BIRANG MANOOCHER (9)· patent assignee history
2013–2018Patents assigned to SWEDEK BOGUSLAW A (4)· patent assignee history
2013Patents assigned to JOHANSSON NILS (2)· patent assignee history
2015–2018Patents assigned to KATEEVA INC (6)· patent assignee history
2015Based in Los Altos, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 156 | 1990–2018 |
| BIRANG MANOOCHERself | 9 | 2012–2018 |
| KATEEVA INC | 6 | 2015–2018 |
| SWEDEK BOGUSLAW A | 4 | 2013–2018 |
| JOHANSSON NILS | 2 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Los Gatos, California, US | 156 | 1992–2018 |
| Santa Clara, California, US | 3 | 1990–1992 |
| Los Altos, California, US | 1 | 2015 |
| Mountain View, California, US | 1 | 2002 |
| Sarasota, Florida, US | 1 | 2002 |