Inventor

Xiong Zhang

Inventor
Shenzhen, CN

Overview

46→
Patents
1996–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 46 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H04Rprimary
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers10%
Y10TTechnical subjects covered by former us classification9%
G06FElectric digital data processing8%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
C23CCoating metallic material6%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes6%
H04LTransmission of digital information, e.g. telegraphic communication6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
B05DProcesses for applying fluent materials to surfaces, in general3%
PatentTitleYear
10,664,436Application acceleration method and application acceleration device202010,633,271Zero-discharge technique for separating sludge and salt from desulfurization wastewater202010,614,077Computer system for automated assessment at scale of topic-specific social media impact202010,392,708Metalized plastic articles and methods thereof201910,309,436Single-groove and short-tail pulling rivet and erection method thereof201910,173,399Anti-yellowing composition, resin composition, metal-resin composite and preparation method and use thereof, and electronic product shell20199,934,512Identifying influential users of a social networking service20189,889,588'Method for integrally molding metal and resin and metal-resin composite structure obtainable by the same'20189,876,019Integrated circuits with programmable memory and methods for producing the same20189,862,131'Method for integrally molding metal and resin and metal-resin composite structure obtainable by the same'20189,770,887'Metalized plastic articles and methods thereof'20179,770,884'Metal-resin composite and method for producing the same'20179,734,235'Grouping documents and data objects via multi-center canopy clustering'20179,678,842'PCIE switch-based server system, switching method and device'20179,672,255'Social media impact assessment'20179,435,035'Metalized plastic articles and methods thereof'20169,401,317'Heat sink mount and assembly'20169,363,604'Speaker box'20169,294,576'Social media impact assessment'20169,239,827'Identifying collocations in a corpus of text in a distributed computing environment'20169,218,630'Identifying influential users of a social networking service'20159,154,865'Acoustic device'20159,103,020'Metalized plastic articles and methods thereof'20159,049,506'Micro-speaker'20158,995,704'Micro-speaker'20158,967,322'Speaker box'20158,938,086'Micro-speaker'20158,920,936'Metalized plastic articles and methods thereof'20148,898,495'Method and apparatus for switching an operating system by determining whether a boot-up mode is a general mode or a switch mode'20148,886,649'Multi-center canopy clustering'20148,846,151'Metalized plastic articles and methods thereof'20148,841,000'Metalized plastic articles and methods thereof'20148,774,448'Speaker with elastic plate coupled to diaphragm'20148,705,788'Speaker and method for fabricating same'20148,649,550'Multi-magnet system and speaker using same'20148,630,441'Multi-magnetic speaker'20148,615,101'Micro-speaker'20138,269,338'Semiconductor device having improved heat dissipation capabilities'2012D0654881'Bridge rectifier package with heat sink'20128,048,714'Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities'2011D0616387'Bridge rectifier package'20107,719,096'Semiconductor device and method for manufacturing a semiconductor device'2010D0573116'Bridge rectifier package with heat sink'20086,867,546'Plasma display panel'20056,524,932'Method of fabricating group-III nitride-based semiconductor device'20035,521,397'Optical device having quantum well structure and barrier layers'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2012Patents assigned to VISHAY GEN SEMICONDUCTOR LLC (6)· patent assignee history
2008–2012Based in Tianjin, CN· patent location history
2013–2016Patents assigned to ZHANG XIONG (21)· patent assignee history
2013–2016Patents assigned to AAC ACOUSTIC TECH SHENZHEN CO (10)· patent assignee history
2013–2020Based in Shenzhen, CN· patent location history
2014–2019Patents assigned to BYD CO LTD (11)· patent assignee history
2014–2019Based in Guangdong, CN· patent location history
2014–2018Based in Bellevue, WA, US· patent location history
2015–2020Patents assigned to MICROSOFT TECHNOLOGY LICENSING LLC (7)· patent assignee history
2016–2020Based in Shanghai, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ZHANG XIONGself212013–2016
BYD CO LTD112014–2019
AAC ACOUSTIC TECH SHENZHEN CO102013–2016
MICROSOFT TECHNOLOGY LICENSING LLC72015–2020
VISHAY GEN SEMICONDUCTOR LLC62008–2012
Locations
LocationPatentsSpan
Shenzhen, CN182013–2020
Guangdong, CN62014–2019
Tianjin, CN62008–2012
Shanghai, CN52016–2020
Bellevue, Washington, US32014–2018