Inventor
Barbara Luther
Inventor
Cold Spring, NY, US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H10DInorganic electric semiconductor devices15%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
H05KPrinted circuits5%
PatentTitleYear
6,593,660'Plasma treatment to enhance inorganic dielectric adhesion to copper'20036,590,290'Stacked via in copper/polyimide BEOL'20036,261,951'Plasma treatment to enhance inorganic dielectric adhesion to copper'20016,255,217'Plasma treatment to enhance inorganic dielectric adhesion to copper'20016,143,640'Method of fabricating a stacked via in copper/polyimide beol'20005,861,658'Inorganic seal for encapsulation of an organic layer and method for making the same'19995,854,141'Inorganic seal for encapsulation of an organic layer and method for making the same'19984,789,648'Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–2003Patents assigned to IBM (8)· patent assignee history
1988Based in Devon, PA, US· patent location history
1998–2003Based in Cold Spring, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 8 | 1988–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cold Spring, New York, US | 7 | 1998–2003 |
| Devon, Pennsylvania, US | 1 | 1988 |