Inventor
CHIEN-YING CHEN
Inventor
TW
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing18%
H10DInorganic electric semiconductor devices18%
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
H10BElectronic memory devices11%
G11CStatic stores7%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
G01BMeasuring length, thickness or similar linear dimensions1%
G11BInformation storage based on relative movement between record carrier and transducer1%
PatentTitleYear
12,487,645Fixing assembly and electronic device202512,430,487Semiconductor device including standard cell having split portions202512,361,192Memory device, integrated circuit device and method202512,300,603Modified fuse structure and method of use202512,243,867Integrated circuit device and method202512,211,791Semiconductor device including deep vias202512,089,402Integrated circuit layout and method202412,080,641Electrical fuse bit cell in integrated circuit having backside conducting lines202412,039,245Semiconductor device including standard cell having split portions202411,854,966Method of forming semiconductor device including deep vias202311,856,760Bit cell with back-side metal line device and method202311,854,968Modified fuse structure and method of use202311,837,539Electrical fuse bit cell in integrated circuit having backside conducting lines202311,803,682Semiconductor device including standard cell having split portions202311,776,949Integrated circuit device and method202311,729,196Modeling cyber-physical attack paths in the internet-of-things202311,696,437Integrated circuit device202311,574,865Method of forming semiconductor device including deep vias202311,549,796Thickness measuring device202311,501,051Memory device, integrated circuit device and method202211,355,488Integrated circuit layout method, device, and system202211,342,341Integrated circuit layout, method, structure, and system2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (19)· patent assignee history
2022–2025Based in TW· patent location history
2023Patents assigned to STANFORD RES INST INT (1)· patent assignee history
2023Patents assigned to TECO IMAGE SYS CO LTD (1)· patent assignee history
2023Based in US· patent location history
2025Patents assigned to ASUSTEK COMP INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 19 | 2022–2025 |
| ASUSTEK COMP INC | 1 | 2025 |
| STANFORD RES INST INT | 1 | 2023 |
| TECO IMAGE SYS CO LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 21 | 2022–2025 |
| US | 1 | 2023 |