Inventor

Madhav Datta

Inventor

Yorktown Heights, NY, US

Overview

1991–2018

Patent span

Electricity

Primary field (CPC H)

Patents· 49 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%

C25FProcesses for the electrolytic removal of materials from objects15%

H05KPrinted circuits11%

Y10TTechnical subjects covered by former us classification10%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%

B23KSoldering or unsoldering4%

C22CAlloys4%

H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy4%

C23FNon-mechanical removal of metallic material from surface3%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%

PatentTitleYear

10,037,956Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same2018 8,952,550'Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same'2015 8,299,604'Bonded metal and ceramic plates for thermal management of optical and electronic devices'2012 8,254,422'Microheat exchanger for laser diode cooling'2012 7,836,597'Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system'2010 7,250,678'Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same'2007 7,196,001'Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same'2007 6,977,224'Method of electroless introduction of interconnect structures'2005 6,917,106'Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps'2005 6,878,465'Under bump metallurgy for Lead-Tin bump over copper pad'2005 6,853,076'Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same'2005 6,750,133'Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps'2004 6,740,427'Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same'2004 6,703,069'Under bump metallurgy for lead-tin bump over copper pad'2004 6,696,758'Interconnect structures and a method of electroless introduction of interconnect structures'2004 6,656,750'Method for testing chips on flat solder bumps'2003 6,258,703'Reflow of low melt solder tip C4\'s'2001 6,238,589'Methods for monitoring components in the TiW etching bath used in the fabrication of C4s'2001 6,228,246'Removal of metal skin from a copper-Invar-copper laminate'2001 6,224,690'Flip-Chip interconnections using lead-free solders'2001 6,103,096'Apparatus and method for the electrochemical etching of a wafer'2000 6,030,728'High performance lithium polymer electrolyte battery'2000 5,989,751'High energy density, flexible lithium primary batteries'1999 5,939,223'Lithium polymer electrolyte battery for sub-ambient temperature applications'1999 5,937,320'Barrier layers for electroplated SnPb eutectic solder joints'1999 5,865,984'Electrochemical etching apparatus and method for spirally etching a workpiece'1999 5,800,726'Selective chemical etching in microelectronics fabrication'1998 5,796,168'Metallic interconnect pad, and integrated circuit structure using same, with reduced undercut'1998 5,759,437'Etching of Ti-W for C4 rework'1998 5,620,611'Method to improve uniformity and reduce excess undercuts during chemical etching in the manufacture of solder pads'1997 5,614,076'Tool and method for electroetching'1997 5,567,300'Electrochemical metal removal technique for planarization of surfaces'1996 5,567,304'Elimination of island formation and contact resistance problems during electroetching of blanket or patterned thin metallic layers on insulating substrate'1996 5,558,957'Method for making a thin flexible primary battery for microelectronics applications'1996 5,543,032'Electroetching method and apparatus'1996 5,536,388'Vertical electroetch tool nozzle and method'1996 5,531,874'Electroetching tool using localized application of channelized flow of electrolyte'1996 5,486,282'Electroetching process for seed layer removal in electrochemical fabrication of wafers'1996 5,476,575'Fabrication of moly masks by electroetching'1995 5,462,638'Selective etching of TiW for C4 fabrication'1995 5,456,788'Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process'1995 5,445,705'Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process'1995 5,284,554'Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces'1994 5,268,072'Etching processes for avoiding edge stress in semiconductor chip solder bumps'1993 5,217,586'Electrochemical tool for uniform metal removal during electropolishing'1993 5,190,463'High performance metal cone contact'1993 5,152,878'Method for electrochemical cleaning of metal residue on molybdenum masks'1992 5,105,537'Method for making a detachable electrical contact'1992 5,066,370'Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2003Patents assigned to IBM (34)· patent assignee history

1991–1993Based in Peekskill, NY, US· patent location history

1992–2001Based in Yorktown Heights, NY, US· patent location history

2001Based in Hillsboro, OR, US· patent location history

2004–2018Patents assigned to INTEL CORP (12)· patent assignee history

2004–2018Based in Portland, OR, US· patent location history

2010–2012Patents assigned to COOLIGY INC (3)· patent assignee history

2010–2012Based in Milpitas, CA, US· patent location history

2012–2015Patents assigned to DATTA MADHAV (3)· patent assignee history

2012Patents assigned to MCMASTER MARK (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	34	1991–2003
INTEL CORP	12	2004–2018
COOLIGY INC	3	2010–2012
DATTA MADHAVself	3	2012–2015
MCMASTER MARK	2	2012

Locations

Location	Patents	Span
Yorktown Heights, New York, US	26	1992–2001
Portland, OR, US	12	2004–2018
Milpitas, California, US	3	2010–2012
Peekskill, New York, US	3	1991–1993
Hillsboro, OR, US	2	2001