Inventor
Kazuhiro Oshima
Inventor
Shibukawa, JP
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Jprimary
C09JAdhesives14%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds12%
C08LCompositions of macromolecular compounds11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H05KPrinted circuits8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
Y10TTechnical subjects covered by former us classification5%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
PatentTitleYear
10,399,470Vehicle seat201910,398,027Wiring board20199,961,767Circuit board and method of manufacturing circuit board20189,538,664'Wiring substrate'20179,247,646'Electronic component built-in substrate and method of manufacturing the same'20168,859,633'Adherent composition and method of temporarily fixing member therewith'20148,723,537'Probe inspecting method and curable resin composition'20148,415,425'Curable resin composition, surface protection method, temporary fixation method, and separation method'20138,410,375'Wiring board and method of manufacturing the same'20138,379,402'Wiring board having lead pin, and lead pin'20138,338,526'Curable resin composition, surface protection method, temporary fixation method, and separation method'20128,313,604'Curable composition and temporary fixation method of member using it'20128,273,827'Adhesive composition and adhesion method'20128,187,411'Adherent composition and method of temporarily fixing member therewith'20128,048,258'Resin composition, and temporary fixing method and surface protecting method for members to be processed, by means thereof'20117,988,811'Adhesive composition and method for temporarily fixing member by using the same'20117,829,605'Energy ray-curable resin composition and adhesive using same'20107,612,127'Curable resin composition'20096,790,461'Hyaluronic acid gel, method of its production and medical material containing it'20046,387,413'Hyaluronic acid gel, a method of its production and medical material containing it'20025,497,559'Method of measuring preload clearance in double row rolling bearing and apparatus therefore'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996Based in Moriyama, JP· patent location history
2002–2014Patents assigned to DENKI KAGAKU KOGYO KK (13)· patent assignee history
2002–2009Based in Machida, JP· patent location history
2010–2014Based in Shibukawa, JP· patent location history
2012–2014Patents assigned to OSHIMA KAZUHIRO (9)· patent assignee history
2012–2014Patents assigned to KANAI TOMOYUKI (5)· patent assignee history
2012–2014Patents assigned to IRIUCHIJIMA KUNIO (2)· patent assignee history
2013–2019Patents assigned to SHINKO ELECTRIC IND CO (6)· patent assignee history
2013–2019Based in Nagano, JP· patent location history
2019Based in Tochigi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DENKI KAGAKU KOGYO KK | 13 | 2002–2014 |
| OSHIMA KAZUHIROself | 9 | 2012–2014 |
| SHINKO ELECTRIC IND CO | 6 | 2013–2019 |
| KANAI TOMOYUKI | 5 | 2012–2014 |
| IRIUCHIJIMA KUNIO | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shibukawa, JP | 10 | 2010–2014 |
| Nagano, JP | 6 | 2013–2019 |
| Machida, JP | 3 | 2002–2009 |
| Tochigi, JP | 1 | 2019 |
| Moriyama, JP | 1 | 1996 |