Inventor
Douglas E. Houston
Inventor
Ballston Lake, NY, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H10DInorganic electric semiconductor devices16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
B23KSoldering or unsoldering8%
C30BSingle-crystal growth8%
F01DNon-positive displacement machines or engines, e.g. steam turbines3%
F05DIndexing scheme for aspects relating to non-positive-displacement machines or engines, gas-turbines or jet-propulsion plants3%
H01RElectrically-conductive connections3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
PatentTitleYear
10,982,551Turbomachine blade20214,720,308'Method for producing high-aspect ratio hollow diffused regions in a semiconductor body and diode produced thereby'19884,595,428'Method for producing high-aspect ratio hollow diffused regions in a semiconductor body'19864,570,173'High-aspect-ratio hollow diffused regions in a semiconductor body'19864,527,183'Drilled, diffused radiation detector'19854,392,153'Cooled semiconductor power module including structured strain buffers without dry interfaces'19834,385,310'Structured copper strain buffer'19834,315,591'Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer'19824,257,156'Method for thermo-compression diffusion bonding each side of a substrateless semiconductor device wafer to respective structured copper strain buffers'19814,252,263'Method and apparatus for thermo-compression diffusion bonding'19814,204,628'Method for thermo-compression diffusion bonding'19804,198,247'Sealant films for materials having high intrinsic vapor pressure'19804,170,491'Near-surface thermal gradient enhancement with opaque coatings'19794,160,679'Migration of fine liquid wires by thermal gradient zone melting through doped surfaces'19794,159,916'Thermal migration of fine lined cross-hatched patterns'19794,159,213'Straight, uniform thermalmigration of fine lines'19794,060,821'Field controlled thyristor with buried grid'19774,032,961'Gate modulated bipolar transistor'19773,998,662'Migration of fine lines for bodies of semiconductor materials having a (100) planar orientation of a major surface'19763,984,169'Keying for lever action connectors'19763,979,769'Gate modulated bipolar transistor'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1976–1988Patents assigned to GEN ELECTRIC (19)· patent assignee history
1976Patents assigned to HUBBELL INC HARVEY (1)· patent assignee history
1976–1983Based in Ballston Lake, NY, US· patent location history
1976Based in Schenectady, NY, US· patent location history
1976Based in Huntington, WV, US· patent location history
1985–1988Based in Liverpool, NY, US· patent location history
2021Patents assigned to RAYTHEON TECH CORP (1)· patent assignee history
2021Patents assigned to UNITED TECHNOLOGIES CORP (1)· patent assignee history
2021Based in Glastonbury, CT, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GEN ELECTRIC | 19 | 1976–1988 |
| HUBBELL INC HARVEY | 1 | 1976 |
| RAYTHEON TECH CORP | 1 | 2021 |
| UNITED TECHNOLOGIES CORP | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ballston Lake, New York, US | 14 | 1976–1983 |
| Liverpool, New York, US | 4 | 1985–1988 |
| Glastonbury, CT, US | 1 | 2021 |
| Schenectady, New York, US | 1 | 1976 |
| Huntington, WV, US | 1 | 1976 |