Inventor
REINHARD MAHNKOPF
Inventor
DE
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10DInorganic electric semiconductor devices17%
H01FMagnets8%
Y10TTechnical subjects covered by former us classification8%
PatentTitleYear
11,764,187Semiconductor packages, and methods for forming semiconductor packages202311,456,116Magnetic coils in locally thinned silicon bridges and methods of assembling same202211,410,908Integrated circuit devices with front-end metal structures202211,145,577Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2023Patents assigned to INTEL CORP (4)· patent assignee history
2021–2022Patents assigned to INTEL IP CORP (2)· patent assignee history
2021–2023Based in DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 4 | 2021–2023 |
| INTEL IP CORP | 2 | 2021–2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 4 | 2021–2023 |