Inventor
MING-CHE HO
Inventor
TW
Overview
Patents· 38 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
C25DProcesses for the electrolytic or electrophoretic production of coatings2%
G02BOptical elements, systems or apparatus2%
H01QAntennas, i.e. radio aerials2%
H10DInorganic electric semiconductor devices2%
G01RMeasuring electric variables1%
G06FElectric digital data processing1%
G06TImage data processing or generation, in general1%
PatentTitleYear
12,593,707Semiconductor structure and manufacturing method thereof202612,557,666Method of manufacturing conductive structure, method of manufacturing redistribution circuit structure and method of manufacturing semiconductor package202612,512,440Semiconductor structure, stacked structure with terminal comprising capping layer and manufacturing method thereof202512,476,157Semiconductor packages and method of manufacturing the same202512,347,791Integrated circuit package and method202512,341,072Manufacturing method of semiconductor package202512,322,682Semiconductor package having composite seed-barrier layer and method of forming the same202512,300,598Package structure and method of fabricating the same202512,288,729Integrated circuit package and method202512,191,203Semiconductor package202512,183,691Semiconductor structure and method of forming the same202412,176,282Manufacturing method of semiconductor package202412,131,986Semiconductor package and manufacturing method thereof202412,094,830Integrated fan-out (InFO) package structure202411,948,890Semiconductor package and method202411,935,804Integrated circuit package and method202411,901,230Semiconductor package and manufacturing method thereof202411,855,014Semiconductor device and method202311,842,955Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure202311,823,981Semiconductor package and manufacturing method thereof202311,775,063Display device and display method202311,658,105Semiconductor package and manufacturing method thereof202311,640,935Semiconductor package and manufacturing method thereof202311,626,339Integrated circuit package and method202311,605,601Semiconductor package and method of forming the same202311,594,484Forming bonding structures by using template layer as templates202311,545,457Semiconductor package, redistribution structure and method for forming the same202311,495,506Semiconductor package with separate electric and thermal paths202211,495,507Manufacturing method of a semiconductor package202211,410,918Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier202211,410,953Via structure for packaging and a method of forming202211,398,416Package structure and method of fabricating the same202211,393,763Integrated fan-out (info) package structure and method202211,387,191Integrated circuit package and method202211,289,410Integrated circuit packages and methods of forming same202211,239,233Integrated circuit packages and methods of forming same202211,217,518Package structure and method of forming the same202211,211,261Package structures and methods for forming the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (37)· patent assignee history
2021–2026Based in TW· patent location history
2023Patents assigned to AMTRAN TECHNOLOGY CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 37 | 2021–2026 |
| AMTRAN TECHNOLOGY CO LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 38 | 2021–2026 |